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RXB0D2 датащи(PDF) 77 Page - Microchip Technology |
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RXB0D2 датащи(HTML) 77 Page - Microchip Technology |
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77 / 92 page ![]() 2003-2012 Microchip Technology Inc. DS21801G-page 77 MCP2515 14.0 PACKAGING INFORMATION 14.1 Package Marking Information 18-Lead PDIP (300 mil) 18-Lead SOIC (300 mil) 20-Lead TSSOP (4.4 mm) XXXXXXXX XXXXXNNN YYWW XXXXXXXXXXXX XXXXXXXXXXXX XXXXXXXXXXXX YYWWNNN XXXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXXX YYWWNNN Example: Example: Example: MCP2515 IST ^ 256 1035 MCP2515 1035256 MCP2515-I/P^^ 0434256 Legend: XX...X Customer-specific information Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) * This package is Pb-free. The Pb-free JEDEC designator ( ) can be found on the outer packaging for this package. Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. 3 e 3 e E/SO^^ 3 e 3 e 3 e XXXXX 20-Lead QFN (4x4) YWWNNN Example: XXXXXX 2515 035256 E/ML^^3 e |
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