RXB0D2 datasheet(72/92 Pages) MICROCHIP

72 / 92 page

MCP2515

DS21801G-page 72

 2003-2012 Microchip Technology Inc.

TABLE 13-1:

DC CHARACTERISTICS

DC Characteristics

Industrial (I):

TAMB = -40°C to +85°C

VDD = 2.7V to 5.5V

Extended (E):

TAMB = -40°C to +125°C

VDD = 4.5V to 5.5V

Param.

No.

Sym

Characteristic

Min

Max

Units

Conditions

VDD

Supply Voltage

2.7

5.5

VRET

2.4

—

High-Level Input Voltage

VIH

RXCAN

VDD + 1

SCK, CS, SI, TXnRTS Pins

0.7 VDD

VDD + 1

OSC1

0.85 VDD

VDD

RESET

0.85 VDD

VDD

Low-Level Input Voltage

VIL

RXCAN, TXnRTS Pins

-0.3

.15 VDD

SCK, CS, SI

-0.3

0.4 VDD

OSC1

VSS

.3 VDD

RESET

VSS

.15 VDD

Low-Level Output Voltage

VOL

TXCAN

—

0.6

IOL = +6.0 mA, VDD = 4.5V

RXnBF Pins

—

0.6

IOL = +8.5 mA, VDD = 4.5V

SO, CLKOUT

—

0.6

IOL = +2.1 mA, VDD = 4.5V

INT

—0.6

IOL = +1.6 mA, VDD = 4.5V

High-Level Output Voltage

VOH

TXCAN, RXnBF Pins

VDD – 0.7

—

IOH = -3.0 mA, VDD = 4.5V

SO, CLKOUT

VDD – 0.5

—

IOH = -400 µA, VDD = 4.5V

INT

VDD – 0.7

—

IOH = -1.0 mA, VDD = 4.5V

Input Leakage Current

ILI

All I/O except OSC1 and

TXnRTS pins

-1

µA

CS = RESET = VDD,

VIN = VSS to VDD

OSC1 Pin

-5

µA

CINT

Internal Capacitance

(All Inputs and Outputs)

—7

TAMB = 25°C, fC = 1.0 MHz,

VDD = 0V (Note 1)

IDD

Operating Current

—

VDD = 5.5V, FOSC = 25 MHz,

FCLK = 1 MHz, SO = Open

IDDS

Standby Current (Sleep mode)

—

µA

CS, TXnRTS = VDD, Inputs tied to

VDD or VSS, -40°C TO +85°C

—8

µA

CS, TXnRTS = VDD, Inputs tied to

VDD or VSS, -40°C TO +125°C

Note 1:

This parameter is periodically sampled and not 100% tested.

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