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RC2012J000CS датащи(PDF) 13 Page - Samsung semiconductor |
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RC2012J000CS датащи(HTML) 13 Page - Samsung semiconductor |
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13 / 19 page ![]() ● TAPING METHOD There are empty holes at both start part and end part of carrier tape. <Fig 5> <Fig 5> Reel Packed Part Empty Part Lead Part Adhesion Tape *** ** **** Empty Portion Chips Empty Portion Lead Part 10 Pitches or more 5,000 Pitches or 20,000 Pitches 10 Pitches or more 200~250 mm Note ① The resistor should move in the pocket freely. ② The resistor should not adhere to the top or bottom tape. ③ There should be no vacant pocket. ④ Peeling strength of the top tape should be within 5gf and 80gf. <Fig 6> <Fig 6> 0~10° Top Tape Chip Resistor Carrier Tape Bottom Tape F Peeling |
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