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RC2012J000CS датащи(PDF) 11 Page - Samsung semiconductor |
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RC2012J000CS датащи(HTML) 11 Page - Samsung semiconductor |
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11 / 19 page ![]() RELIABILITY TEST CONDITION ● PACKAGING METHOD RELIABILITY TEST CONDITION PACKAGING ● REEL TYPE PACKAGING SPECIFICATION <Fig 2-1> PACKAGING <Fig 2> Packaging protects the resistor from damage during the shipping or storage. There are two types of packaging method ; one is "Reel" type, and the other is "Bulk" type. The packaging specification is based on the EIAJ RC-1009. <Fig 2> is tape dimension For 0603 type. <Table 5> is for pocket sizes, A and B. 0.5 Max 1.0 2.0±0.05 4.0±0.1 A B 1.5± 0.1 0 1.75±0.1 3.5±0.05 0.5 Max Chip Resistor Top Tape Carrier Tape <Fig 2-1> is tape dimension For 1005 type. <Table 5> is for pocket sizes, A and B. 0.6 Max 1.0 2.0±0.05 A B 1.5± 0.1 0 1.75±0.1 3.5±0.05 8.0±0.1 0.6 Max Chip Resistor Bottom Tape Top Tape Carrier Tape |
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