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TEST BOARD AND SPECIFICATION

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Soldering (for lead free type)

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The resistor should be fixed on PCB(printed circuit board) for testing.

- Soldering specification : JIS C 5201-1 4.18

* Soldering method : Flow type (Dipping type)

* Solder : Sn -3.0 Ag -0.5 Cu

* FLUX : ROSIN 25WT% (JIS K 5902), IPA 75WT% (JIS K 5901)

- Flow soldering condition

* FLUX dipping time : 5∼10 sec

* Pre-treatment : None

* Soldering temp : 260℃±5℃

* Soldering time : 10±1 sec

item

Permissible deviation

Test method

Resistor

Jumper

Low

temperature

exposure

1. No mechanical

damage

within ±(3%+0.1Ω)

50mΩ

Maximum

묤 Standard : JIS C 5201-1 4.23

묤 Test temperature : -55 ± 2℃

묤 Test time : 1000

묤 Measure : after 1 hour

묤 Test board : <Fig 11>

High

temperature

exposure

1. No mechanical

damage

within ±(3%+0.1Ω)

50mΩ

Maximum

묤 Standard : JIS C 5201-1 4.23

묤 Test temperature : 1608,2012,3216 155±2℃,

Others 125 ± 2℃

묤 Test time : 1000

묤 Measure : after 1 hour

묤 Test board : <Fig 11>

Load life

1. No mechanical

damage

within <Table 13>

50mΩ

Maximum

묤 Standard : JIS C 5201-1 4.25

묤 Test temperature : 70 ± 2℃

묤 Test voltage : rated voltage

묤 Test time :repeat90min ON, 30min OFF

during 1000

묤 Test board : <Fig 11>.

<Table 13>

Range( Ω)

1≤ R < 10

±

5%

10 ≤ R < 1M

±(3% +0 .1Ω)

1M ≤ R < 10M

±

5%