HCS473_13 datasheet(58/68 Pages) MICROCHIP

номер детали	HCS473

подробное описание детали	KEELOQ짰 3-Axis Transcoder

PDF	68 Pages

Scroll/Zoom	100%

производитель	MICROCHIP [Microchip Technology]

домашняя страница	http://www.microchip.com

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58 / 68 page

HCS473

DS40035D-page 58

Preliminary

 2000-2013 Microchip Technology Inc.

14-Lead Plastic Dual In-line (P) – 300 mil (PDIP)





Units

INCHES*

MILLIMETERS

Dimension Limits

MIN

NOM

MAX

MIN

NOM

MAX

Number of Pins

Pitch

.100

2.54

Top to Seating Plane

.140

.155

.170

3.56

3.94

4.32

Molded Package Thickness

.115

.130

.145

2.92

3.30

3.68

Base to Seating Plane

.015

0.38

Shoulder to Shoulder Width

.300

.313

.325

7.62

7.94

8.26

Molded Package Width

.240

.250

.260

6.10

6.35

6.60

Overall Length

.740

.750

.760

18.80

19.05

19.30

Tip to Seating Plane

.125

.130

.135

3.18

3.30

3.43

Lead Thickness

.008

.012

.015

0.20

0.29

0.38

Upper Lead Width

.045.058.070

1.141.461.78

Lower Lead Width

.014

.018

.022

0.36

0.46

0.56

Overall Row Spacing

.310

.370

.430

7.87

9.40

10.92

Mold Draft Angle Top





Mold Draft Angle Bottom

* Controlling Parameter

Notes:

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed

.010” (0.254 mm) per side.

JEDEC Equivalent: MS-001

Drawing No. C04-005

§ Significant Characteristic

Note:

For the most current package drawings, please see the Microchip Packaging Specification located

at http://www.microchip.com/packaging

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