SSM2160/SSM2161

–4–

REV. 0

ABSOLUTE MAXIMUM RATINGS

1

Supply Voltage

Dual Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

±18 V

Single . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +36 V

Logic Input Voltage . . . . . . . . . . . . . . . . . . . . . –0.3 V to +5 V

Operating Temperature Range . . . . . . . . . . . . . 0

°C to +70°C

Storage Temperature Range . . . . . . . . . . . . –65

°C to +150°C

Junction Temperature Range . . . . . . . . . . . . –65

°C to +165°C

Lead Temperature Range (Soldering, 60 sec) . . . . . . . +300

°C

ESD Ratings

883 (Human Body) Model . . . . . . . . . . . . . . . . . . . . . . 2.5 kV

PACKAGE THERMAL INFORMATION

Package Type

3

JA

JC

Units

24-Pin Plastic P-DIP

60

30

°C/W

24-Pin SOIC

71

23

°C/W

20-Pin Plastic P-DIP

65

26

°C/W

20-Pin SOIC

84

24

°C/W

NOTES

°C unless otherwise noted.

3

θ

packages and for device soldered onto a circuit board for SOIC packages.

ORDERING GUIDE

Temperature

Package

Package

Model

Range

Description

Option

SSM2160P

0

°C to +70°C

24-Lead Plastic DIP N-24

SSM2160S

0

°C to +70°C

24-Lead SOL

R-24

SSM2160S-REEL

0

°C to +70°C

24-Lead SOL

R-24

SSM2161P

0

°C to +70°C

20-Lead Plastic DIP N-20

SSM2161S

0

°C to +70°C

20-Lead SOL

R-20

SSM2161S-REEL

0

°C to +70°C

20-Lead SOL

R-20

PIN CONFIGURATIONS

24-Lead Epoxy DIP and SOIC

13

16

15

14

24

23

22

21

20

19

18

17

TOP VIEW

(Not to Scale)

12

11

10

9

8

1

2

3

4

7

6

5

SSM2160

V+

VOUT2

MSTR SET

MSTR OUT

CH SET

AGND

VOUT1

VIN4

VOUT4

VIN2

VIN1

VOUT3

VIN3

VOUT5

VIN5

WRITE

DATA

VIN6

VOUT6

LD

V–

CLK

DGND

20-Lead Epoxy DIP and SOIC

14

13

12

11

17

16

15

20

19

18

10

9

8

1

2

3

4

7

6

5

TOP VIEW

(Not to Scale)

SSM2161

V+

VOUT2

MSTR SET

MSTR OUT

CH SET

AGND

VOUT1

VIN4

VOUT4

VIN2

VIN1

VOUT3

VIN3

WRITE

LD

V–

DGND

CLK

DATA