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ADDC02803SC датащи(PDF) 15 Page - Analog Devices |
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ADDC02803SC датащи(HTML) 15 Page - Analog Devices |
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15 / 18 page ![]() ADDC02803SC/ADDC02805SA REV. A –15– Circuit Setup for EMI Test Figure 23 shows a schematic of the test setup used for the EMI measurements discussed above. The output of the converter is connected to a resistive load designed to draw full power. There is a 0.1 µF capacitor placed across this resistor that typifies by- pass capacitance normally used in this application. At the input of the converter there are two differential capacitors (the larger one having a series resistance) and two small common-mode capacitors connected to case ground. The case itself was con- nected to the metal ground plane in the test chamber. For the RE102 test, a metal screen box was used to cover both the con- verter and its load (but not the two meters of input power lead cables). This box was also electrically connected to the metal ground plane. With regard to the components added to the input power lines, the 100 µF capacitor with its 1 Ω series resistance is required to achieve system stability when the unit is powered through the LISNs, as the MIL-STD-461D standard requires. These LISNs have a series inductance of 50 µH at low frequencies, giving a total differential inductance of 100 µH. As explained earlier in the System Instability section, such a large series source inductance will cause an instability as it interacts with the converter’s negative incremental input resistance unless some corrective action is taken. The 100 µF capacitor and 1 Ω resis- tor provide the stabilization required. It should be noted that the values of these stabilization components are appropriate for a single converter load. If the system makes use of several converters, the values of the components will need to be slightly changed, but not such that they are repeated for every converter. It should also be noted that most system appli- cations will not have a source inductance as large as the 100 µH built into the LISNs. For those systems, a much smaller input capacitor could be used. Increasing Margin Between Specification Limit and Measured Results With regard to the 2 µF differential-mode capacitor and the two 82 nF common-mode capacitors, these components were in- cluded in the test setup to augment the performance of the power supply’s internal EMI filter. The values were chosen to achieve the results shown in Figures 20 and 22. To increase the margin between the specification limits and the measured emis- sions, larger external component values could be used. To do this it is useful to know that most of the emissions below 10 MHz, whether conducted or radiated, are due to differential- mode currents flowing in the input power leads. To make the emissions in this frequency range smaller, the differential ca- pacitor value should be increased above 2 µF. Conversely, most of the emissions above 10 MHz are due to common-mode cur- rents; to make them smaller the common-mode capacitors should be increased above the 82 nF value. In both cases it is important to minimize the parasitic inductance of the capaci- tors; the use of several smaller capacitors connected in parallel is one way to achieve this. Using larger valued capacitors than those shown in Figure 23 is a good solution if an additional 6 dB–10 dB of margin is de- sired. If, however, in an extremely sensitive application it is desired to increase the margin by 20 dB or more, it may be better to add both differential- and common-mode inductors to the external components to make a higher order filter. RELIABILITY CONSIDERATIONS MTBF (Mean Time Between Failure) is a commonly used reliability concept that applies to repairable items in which failed elements are replaced upon failure. The expression for MTBF is MTBF = T/r where: T = total operating time r = number of failures In lieu of actual field data, MTBF can be predicted per MIL-HDBK-217. MTBF, Failure Rate and Probability of Failure: A proper understanding of MTBF begins with its relationship to lambda ( λ), which is the failure rate. If a constant failure rate is assumed, then MTBF = 1/ λ, or λ = 1/MTBF. If a power supply has an MTBF of 1,000,000 hours, this does not mean it will last 1,000,000 hours before it fails. Instead, the MTBF describes the failure rate. For 1,000,000 hours MTBF, the failure rate during any hour is 1/1,000,000, or 0.0001%. Thus, a power supply with an MTBF of 500,000 hours would have twice the failure rate (0.0002%) of one with 1,000,000 hours. What users should be interested in is the probability of a power supply not failing prior to some time t. Given the assumption of a constant failure rate, this probability is defined as R(t ) = e–λt where R(t) is the probability of a device not failing prior to some time t. If we substitute λ = 1/MTBF in the above formula, then the expression becomes R(t ) = e –t MTBF This formula is the correct way to interpret the meaning of MTBF. If we assume t = MTBF = 1,000,000 hours, then the probability that a power supply will not fail prior to 1,000,000 hours of use is e –1, or 36.8%. This is quite different from saying the power supply will last 1,000,000 hours before it fails. The probability that the power supply will not fail prior to 50,000 hours of use is e –0.05, or 95%. For t = 10,000 hours, the probability of no fail- ure is e –0.01, or 99%. Temperature and Environmental Factors: Although the calculation of MTBF per MIL-HDBK-217 is a detailed process, there are two key variables that give the manufacturer signi- ficant leeway in predicting an MTBF rating. These two vari- ables are temperature and environmental factor. For users to properly compare MTBF numbers from two different manu- facturers, the environmental factor and the temperature must be identical. Contact the factory for MTBF calculations for specific environmental factors and temperatures. |
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