Pad Description

Pad Name

I/O

Function

RES

I

Schmitt trigger reset input. Active low

PA0/BZ

PA1/BZ

I/O

I/O

Bidirectional 2-bit input/output port. Each bit can be a wake-up input. The PA0 and PA1 are

pin-shared with the BZ and BZ, respectively. Once the PA0 and PA1 are selected as buzzer

driving outputs, the output signals come from an internal buzzer clock generator.

Software instructions determine the CMOS output or Schmitt trigger input with pull-high re-

sistor (mask option).

PA2/EL

I/O

Bidirectional 1-bit input/output port. This bit can be a wake-up input. The PA2 is pin-shared

with the EL carrier output. Once the PA2 is selected as EL carrier output, the output signal

comes from an internal EL carrier clock generator. Software instructions determine the

CMOS output or Schmitt trigger input with pull-high resistor (mask option).

PA3~PA7

I/O

Bidirectional 5-bit input/output port. Each bit can be a wake-up input.

Software instructions determine the CMOS output or Schmitt trigger input with pull-high re-

sistor (mask option).

VSS

¾

Negative power supply, ground

VCC, C1, C2

¾

Voltage doubler, VCC=2

´VDD

VCC: LCD power supply voltage, connect a capacitor between VCC and VSS.

C1, C2: Switching pins for VCC, connect a capacitor between C1 and C2.

COM0~COM1,

COM2/SEG13

O

The 1/3 LCD duty cycle configuration option will determine whether pin COM2/SEG13 is

configured as a SEG13 segment driver or as a common COM2 output driver for the LCD

panel. COM0~COM1 are the LCD common outputs.

SEG0~SEG12

O

LCD driver outputs for LCD panel segments.

VDD

¾

Positive power supply

LVD

¾

Low voltage detector. Connect a resistor between VSS and LVD.

RCIN

I

RC type A/D converter input pin for RC oscillation.

RREF

O

RC type A/D converter output pin for reference resistor oscillation.

RSEN

O

RC type A/D converter output pin for sensor resistor oscillation.

OSC1

OSC2

¾

System oscillator pin, connect a resistor between OSC1 and OSC2.

TRIM1~TRIM2

I

TEST mode input pin. Let open in normal mode.

Absolute Maximum Ratings

Storage Temperature ............................

-50°Cto125°C

Operating Temperature...........................

-40°Cto85°C

-100mA

Total Power Dissipation .....................................500mW

Note: These are stress ratings only. Stresses exceeding the range specified under

²Absolute Maximum Ratings² may

cause substantial damage to the device. Functional operation of this device at other conditions beyond those listed

in the specification is not implied and prolonged exposure to extreme conditions may affect device reliability.

HT47C06L

Rev. 1.00

3

June 15, 2007