CDH2D09 datasheet(4/44 Pages) MAXIM

4 / 44 page

PMIC with Integrated Charger and

Smart Power Selector for Handheld Devices

_______________________________________________________________________________________

ABSOLUTE MAXIMUM RATINGS

ELECTRICAL CHARACTERISTICS

(DC, USB, BVSET, UOK, DOK, LX_ unconnected; VTHM = VL/2, VPG_ = VAGND = 0V, VBAT = 4V, CEN = low, USUS = low, EN = high,

VPEN1 = VPEN2 = 3.3V, VPWM = 0V, COUT4 = 1µF, COUT5 = 1µF, CSYS = 10µF, PV1 = PV2 = PV3 = PV4 = PV5 = SYS, RDISET = 3kΩ,

RCISET = 3kΩ, CVL = 0.1µF, CCT = 0.15µF, CBP = 0.01µF, VFB1 = 1.1V, VFB2 = 1.1V, VFB3 = 1.1V, TA = -40°C to +85°C, unless other-

wise noted.) (Note 2)

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional

operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to

absolute maximum rating conditions for extended periods may affect device reliability.

USB, DC, PEN1 to AGND.......................................-0.3V to +16V

SYS, BAT, PV1, PV2, PV3 to AGND..........................-0.3V to +6V

PG1, PG2, PG3, AGND .........................................-0.3V to +0.3V

PV1, PV2, PV3 to SYS............................................-0.3V to +0.3V

VL to AGND ...........................................................-0.3V to +4.0V

CISET, DISET, BVSET, CT, THM to AGND..-0.3V to (VVL + 0.3V)

PV4, PV5, BP, FB1, FB2, FB3 to AGND ....-0.3V to (VSYS + 0.3V)

PEN2, USUS, CEN, EN, PWM to AGND ..................-0.3V to +6V

CST1, CST2, DOK, UOK to AGND ...........................-0.3V to +6V

OUT4, FB4 to AGND .................................-0.3V to (VPV4 + 0.3V)

OUT5, FB5 to AGND .................................-0.3V to (VPV5 + 0.3V)

LX1, LX2, LX3 Continuous RMS Current (Note 1).................1.5A

BAT Continuous Current .......................................................1.5A

SYS Continuous Current .......................................................1.5A

Continuous Power Dissipation (TA = +70°C)

40-Pin, 5mm x 5mm, Thin QFN (derate 35.7mW/°C

above +70°C)..............................................................2857mW

Operating Junction Temperature.....................................+150°C

Storage Junction Temperature Range ..............-65°C to +150°C

Lead Temperature (soldering, 10s) .................................+300°C

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

DC POWER INPUT (VDC = 5.0V, EN = low)

Operating voltage

4.1

6.6

DC Voltage Range

VDC

Withstand voltage

SYS Regulation Voltage

VSYS_REG

VDC = 6V, USUS = low, CEN = high, system

current is less than the input current limit

5.2

5.3

5.4

DC Undervoltage Threshold

VDCL

VDC rising, 500mV typical hysteresis

3.95

4.00

4.05

DC Overvoltage Threshold

VDCH

VDC rising, 400mV typical hysteresis

6.8

6.9

7.0

PEN1 = low,

PEN2 = low,

USUS = low

100

PEN1 = low,

PEN2 = high,

USUS = low

450

475

500

DC Current Limit

IDCLIM

VDC = 6V, VSYS = 5V

USB unconnected,

CEN = low,

TA = +25°C,

VL = no load

(Note 3)

PEN1 = high,

RDISET = 3k

950

1000

1050

RDISET Resistance Range

PEN1 = low, USUS = high

0.11

USUS = low, CEN = low;

ISYS = 0mA, IBAT = 0mA, EN = low;

VL no load

1.1

DC Quiescent Current

IDCIQ

USUS = low, CEN = high;

ISYS = 0mA, VEN = 0V, VL no load

0.7

Minimum DC-to-BAT Voltage

Headroom

VDC falling, 200mV hysteresis

Minimum DC-to-SYS Voltage

Headroom

VDC falling, 200mV hysteresis

DC-to-SYS Dropout Resistance

RDS

VDC = 5V, ISYS = 400mA, USUS = low

0.325

0.600

Note 1: LX_ has internal clamp diodes to PG_ and PV_. Applications that forward bias these diodes must take care not to exceed

the package power dissipation limits.

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