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ZXLD1371QESTTC датащи(PDF) 40 Page - Diodes Incorporated |
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ZXLD1371QESTTC датащи(HTML) 40 Page - Diodes Incorporated |
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40 / 42 page ![]() ZXLD1371 ZXLD1371 Document number: DS35436 Rev. 1 - 2 40 of 42 www.diodes.com February 2012 © Diodes Incorporated A Product Line of Diodes Incorporated Applications Information (cont.) PCB Layout Considerations PCB layout is a fundamental to device performance in all configurations. Figure 20 shows a section of a proven ZXLD1371 PCB layout. Figure 20. Circuit Layout Here are some considerations useful for the PCB layout using ZXLD1371 in Buck, Boost and Buck-boost configurations: In order to avoid ringing due to stray inductances, the inductor L1, the anode of D1 and the drain of Q1 should be placed as close together as possible. The shaping capacitor C1 is fundamental for the stability of the control loop. To this end it should be placed no more than 5mm from the SHP pin. Input voltage pins, VIN and VAUX, need to be decoupled. It is recommended to use two ceramic capacitors of 2.2uF, X7R, 100V (C3 and C4). In addition to these capacitors, it is suggested to add two ceramic capacitors of 1uF, X7R, 100V each (C2, C8), as well as a further decoupling capacitor of 100nF close to the VIN/VAUX pins (C9). VIN and VAUX pins can be short-circuited when the device is used in buck mode, or can be driven from a separate supply. The underside of the PCB should be a solid copper ground plane, electrically bonded to top ground copper at regular intervals using plated-thro via holes. The ground plane should be unbroken as far as possible, particularly in the area of the switching circuit including the ZXLD1371, L1, Q1 D, C3 and C4. Plated via holes are necessary to provide a short electrical path to minimize stray inductance. Critical positions of via holes include the decoupling capacitors, the source connection of the MOSFET and the ground connections of the ZXLD1371, including the centre paddle. These via holes also serve to conduct heat away from the semiconductors and minimize the device junction temperatures. Evaluation Boards To support easier evaluation of the ZXLD1371 three evaluation boards have been developed which available via your Diodes sales representative for qualified opportunities: ZXLD1371EV1 Buck configuration ZXLD1371EV2 Buck-boost configuration ZXLD1371EV3 Boost configuration SHP pin VIN / VAUX decoupling Inductor, Switch and Freewheeling diode |
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