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LH28F008SA датащи(PDF) 16 Page - Sharp Corporation |
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LH28F008SA датащи(HTML) 16 Page - Sharp Corporation |
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16 / 27 page ![]() LH28F008SA 8M (1M × 8) Flash Memory 16 *WARNING: Stressing the device beyond the “Abso- lute Maximum Ratings” may cause permanent dam- age. These are stress ratings only. Operation beyond the “Operating Conditions” is not recommended and extended exposure beyond the “Operating Conditions” may affect device reliability. SYMBOL PARAMETER MIN. MAX. UNITS NOTE T A Operating Temperature 0 70.0 °C V CC V CC Supply Voltage (10%) 4.50 5.50 V 5 V CC V CC Supply Voltage (5%) 4.75 5.25 V 5 NOTES: 1. Operating temperature is for commercial product defined by this specification. 2. Minimum DC voltage is -0.5 V on input/output pins. During transitions, this level may undershoot to -2.0 V for periods < 20 ns. Maximum DC voltage on input/output pins is VCC + 0.5 V which, during transitions, may overshoot to VCC + 2.0 V for periods < 20 ns. 3. Maximum DC voltage on VPP may overshoot to +14.0 V for periods < 20 ns. 4. Output shorted for no more than one second. No more than one output shorted at a time. 5. 5% VCC specification reference the LH28F008SA-85 in its High Speed configuration, 10% VCC specifications reference the LH28F008SA-85 in its Standard configuration, and the LH28F008SA-12. ABSOLUTE MAXIMUM RATINGS* Operating Temperature During Read ......................................... 0°C to +70°C1 During Block Erase/Byte Write ............... 0°C to +70°C Temperature Under Bias ..................... -10°C to +80°C StorageTemperature ......................... -65°C to +125°C Voltage on Any Pin (except VCC and VPP) with Respect to GND ..................... -2.0 V to +7.0 V2 VPP Program Voltage with Respect to GND during Block Erase/Byte Write ............. -2.0 V to +14.0 V2, 3 VCC Supply Voltage with Respect to GND ........................................... -2.0 V to +7.0 V2 Output Short Circuit Current .......................... 100 mA4 DC CHARACTERISTICS SYMBOL PARAMETER TYP. MIN. MAX. UNITS TEST CONDITIONS NOTE I LI Input Load Current ±1.0 µA V CC = VCC MAX., VIN = VCC or GND 1 I LO Output Leakage Current ±10.0 µA V CC = VCC MAX., VOUT = VCC or GND 1 I CCS V CC Standby Current 1.0 2.0 mA V CC = VCC MAX., CE » = PWD = VIH 1, 3 30 100.0 µA V CC = VCC MAX., CE » = PWD = Vcc ±0.2 V I CCD V CC Deep Power Down Current 0.20 1.2 µA PWD = GND ±0.2 I OUT (RY »/BY ») = 0 mA 1 I CCR V CC Read Current 20 35.0 mA V CC = VCC MAX., CE » = GND f = 8 MHz, I OUT = 0 mA CMOS Inputs 1 25 50.0 mA V CC = VCC MAX., CE » = VIL f = 8 MHz, I OUT = 0 mA TTL Inputs OPERATING CONDITIONS |
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