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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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LTC4263 датащи(PDF) 26 Page - Linear Technology |
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LTC4263 датащи(HTML) 26 Page - Linear Technology |
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26 / 28 page  LTC4274 26 4274fa PACKAGE DESCRIPTION UHF Package 38-Lead Plastic QFN (5mm × 7mm) (Reference LTC DWG # 05-08-1701 Rev C) 5.00 0.10 NOTE: 1. DRAWING CONFORMS TO JEDEC PACKAGE OUTLINE M0-220 VARIATION WHKD 2. DRAWING NOT TO SCALE 3. ALL DIMENSIONS ARE IN MILLIMETERS PIN 1 TOP MARK (SEE NOTE 6) 37 1 2 38 BOTTOM VIEW—EXPOSED PAD 5.50 REF 5.15 ± 0.10 7.00 0.10 0.75 0.05 R = 0.125 TYP R = 0.10 TYP 0.25 0.05 (UH) QFN REF C 1107 0.50 BSC 0.200 REF 0.00 – 0.05 RECOMMENDED SOLDER PAD LAYOUT APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED 3.00 REF 3.15 ± 0.10 0.40 0.10 0.70 0.05 0.50 BSC 5.5 REF 3.00 REF 3.15 ± 0.05 4.10 0.05 5.50 0.05 5.15 ± 0.05 6.10 0.05 7.50 0.05 0.25 0.05 PACKAGE OUTLINE 4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE 5. EXPOSED PAD SHALL BE SOLDER PLATED 6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE PIN 1 NOTCH R = 0.30 TYP OR 0.35 45 CHAMFER |
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