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33981 датащи(PDF) 34 Page - Freescale Semiconductor, Inc |
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33981 датащи(HTML) 34 Page - Freescale Semiconductor, Inc |
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34 / 37 page ![]() Analog Integrated Circuit Device Data 34 Freescale Semiconductor 33981 ADDITIONAL DOCUMENTATION THERMAL ADDENDUM (REV 2.0) Figure 45. Thermal Test Board Device on Thermal Test Board RθJA is the thermal resistance between die junction and ambient air . This device is a dual die package. Index m indicates the die that is heated. Index n refers to the number of the die where the junction temperature is sensed. 16-Pin PQFN 0.90 mm Pitch 12.0mm x 12.0mm Body 33981 Pin Connections Transparent Top View A with exposed pads 16 15 14 13 OUT OUT GND VPWR Material: Single layer printed circuit board FR4, 1.6 mm thickness Cu traces, 0.07 mm thickness Outline: 80 mm x 100 mm board area, including edge connector for thermal testing Area A: Cu heat-spreading areas on board surface Ambient Conditions: Natural convection, still air Table 8. Thermal Resistance Performance Thermal Resistance Area A (mm2) 1 = Power Chip, 2 = Logic Chip ( °C/W) m = 1, n = 1 m = 1, n = 2 m = 2, n = 1 m = 2, n = 2 ΡθJAmn 0 66 51 84 300 47 37 73 600 43 34 70 |
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