поискавой системы для электроныых деталей
  Russian  ▼
ALLDATASHEETRU.COM

X  

PCA85232DA датащи(PDF) 53 Page - NXP Semiconductors

номер детали PCA85232DA
подробное описание детали  LCD driver for low multiplex rates
PDF  54 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
производитель  NXP [NXP Semiconductors]
домашняя страница  http://www.nxp.com
Logo NXP - NXP Semiconductors

PCA85232DA датащи(HTML) 53 Page - NXP Semiconductors

Back Button PCA85232DA Datasheet HTML 46Page - NXP Semiconductors PCA85232DA Datasheet HTML 47Page - NXP Semiconductors PCA85232DA Datasheet HTML 48Page - NXP Semiconductors PCA85232DA Datasheet HTML 49Page - NXP Semiconductors PCA85232DA Datasheet HTML 50Page - NXP Semiconductors PCA85232DA Datasheet HTML 51Page - NXP Semiconductors PCA85232DA Datasheet HTML 52Page - NXP Semiconductors PCA85232DA Datasheet HTML 53Page - NXP Semiconductors PCA85232DA Datasheet HTML 54Page - NXP Semiconductors  
Zoom Inzoom in Zoom Outzoom out
 53 / 54 page
background image
PCA85232
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 1 — 8 December 2010
53 of 54
NXP Semiconductors
PCA85232
LCD driver for low multiplex rates
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
Bare die — All die are tested on compliance with their related technical
specifications as stated in this data sheet up to the point of wafer sawing and
are handled in accordance with the NXP Semiconductors storage and
transportation conditions. If there are data sheet limits not guaranteed, these
will be separately indicated in the data sheet. There are no post-packing tests
performed on individual die or wafers.
NXP Semiconductors has no control of third party procedures in the sawing,
handling, packing or assembly of the die. Accordingly, NXP Semiconductors
assumes no liability for device functionality or performance of the die or
systems after third party sawing, handling, packing or assembly of the die. It
is the responsibility of the customer to test and qualify their application in
which the die is used.
All die sales are conditioned upon and subject to the customer entering into a
written die sale agreement with NXP Semiconductors through its legal
department.
18.4
Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
I2C-bus — logo is a trademark of NXP B.V.
19. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com



Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54


датащи скачать

Go To PDF Page


ссылки URL



Вашему бизинису помогли Аллдатащит?  [ DONATE ] 

Что такое Аллдатащит   |   реклама   |   контакт   |   Конфиденциальность   |   Ссылка на техническое описание    |   обмен ссыками   |   поиск по производителю
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com