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M24C32-R датащи(PDF) 31 Page - STMicroelectronics |
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M24C32-R датащи(HTML) 31 Page - STMicroelectronics |
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31 / 38 page ![]() M24C32-W M24C32-R M24C32-F Package mechanical data Doc ID 4578 Rev 17 31/38 Figure 16. UFDFPN8 (MLP8) – 8-lead ultra thin fine pitch dual flat package no lead 2 × 3mm, package outline 1. Drawing is not to scale. 2. The central pad (the E2 × D2 area in the above illustration) is internally pulled to VSS. It should not be connected to any other voltage or signal line on the PCB, for example during the soldering process. Table 20. UFDFPN8 (MLP8) – 8-lead ultra thin fine pitch dual flat package no lead 2 × 3mm, package mechanical data Symbol millimeters inches(1) 1. Values in inches are converted from mm and rounded to 4 decimal digits. Typ Min Max Typ Min Max A 0.55 0.50 0.60 0.0217 0.0197 0.0236 A1 0.02 0.00 0.05 0.0008 0 0.0020 b 0.25 0.20 0.30 0.0098 0.0079 0.0118 D 2.00 1.90 2.10 0.0787 0.0748 0.0827 D2 1.60 1.50 1.70 0.0630 0.0591 0.0669 ddd 0.08 0.0031 E 3.00 2.90 3.10 0.1181 0.1142 0.1220 E2 0.20 0.10 0.30 0.0079 0.0039 0.0118 e0.50– – 0.0197 – – L 0.45 0.40 0.50 0.0177 0.0157 0.0197 L1 0.15 0.0059 L3 0.30 0.0118 D E UFDFPN-01 A A1 ddd L1 e b D2 L E2 L3 |
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