41210 datasheet(39/52 Pages) INTEL

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Datasheet — 41210 Bridge

Table 30.

41210 Bridge Thermal Specifications

Note:

Mode 1: PCI-X 66MHz, 64-bit, 4 slots/devices

No Connect: Unused PCI segment (no slots/devices on PCI bus segment)

3.9.3

Thermal Solution Component Suppliers

3.9.3.1

Torsional Clip Heatsink Thermal Solution

Note:

The enabled components may not be currently available from all suppliers. Contact the supplier

directly to verify time of component availability.

Parameter

Maxinum

Tcase

105×C

TDPMode#1/Mode#1

8.70W

TDPMode#1/No Connect

8.30W

TDPDDR/No Connect

8.10W

Part

Intel Part Number

Supplier

(Part Number)

Contact Information

Heatsink Assembly includes:

Unidirectional Fin Heatsink

Thermal Interface Material

Torsional Clip

C76435-001

CCI/ACK

Harry Lin (USA)

714-739-5797

hlinack@aol.com

Monica Chih (Taiwan)

866-2-29952666, x131

monica_chih@ccic.com.tw

Unidirectional Fin Heatsink

(31.0 x 31.0 x 12.2mm)

C76434-001

CCI/ACK

Harry Lin (USA)

714-739-5797

hlinack@aol.com

Monica Chih (Taiwan)

866-2-29952666, x131

monica_chih@ccic.com.tw

Thermal Interface

(Chomerics T-710)

A69230-001

Chomerics

69-12-22066-T710

Todd Sousa (USA)

360-606-8171

tsousa@parker.com

Heatsink Attach Clip

C17725-001

CCI/ACK

Harry Lin (USA)

714-739-5797

hlinack@aol.com

Monica Chih (Taiwan)

866-2-29952666, x131

monica_chih@ccic.com.tw

Solder-Down Anchor

A13494-005

Foxconn

(HB96030-DW)

Julia Jiang (USA)

408-919-6178

juliaj@foxconn.com

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