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ADP320 датащи(PDF) 17 Page - Analog Devices |
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ADP320 датащи(HTML) 17 Page - Analog Devices |
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17 / 20 page ![]() ADP320 Rev. 0 | Page 17 of 20 CURRENT-LIMIT AND THERMAL OVERLOAD PROTECTION The ADP320 triple LDO is protected against damage due to excessive power dissipation by current and thermal overload protection circuits. The ADP320 triple LDO is designed to current limit when the output load reaches 300 mA (typical). When the output load exceeds 300 mA, the output voltage is reduced to maintain a constant current limit. Thermal overload protection is built-in, which limits the junction temperature to a maximum of 155°C (typical). Under extreme conditions (that is, high ambient temperature and power dissipation) when the junction temperature starts to rise above 155°C, the output is turned off, reducing the output current to zero. When the junction temperature drops below 140°C, the output is turned on again and the output current is restored to its nominal value. Consider the case where a hard short from VOUTx to GND occurs. At first, the ADP320 triple LDO current limits, so that only 300 mA is conducted into the short. If self-heating of the junction is great enough to cause its temperature to rise above 155°C, thermal shutdown activates turning off the output and reducing the output current to zero. As the junction tempera- ture cools and drops below 140°C, the output turns on and conducts 300 mA into the short, again causing the junction temperature to rise above 155°C. This thermal oscillation between 140°C and 154°C causes a current oscillation between 0 mA and 300 mA that continues as long as the short remains at the output. Current and thermal limit protections are intended to protect the device against accidental overload conditions. For reliable operation, device power dissipation must be externally limited so junction temperatures do not exceed 125°C. THERMAL CONSIDERATIONS In most applications, the ADP320 triple LDO does not dissipate a lot of heat due to high efficiency. However, in applications with a high ambient temperature and high supply voltage to out- put voltage differential, the heat dissipated in the package is large enough that it can cause the junction temperature of the die to exceed the maximum junction temperature of 125°C. When the junction temperature exceeds 155°C, the converter enters thermal shutdown. It recovers only after the junction temperature has decreased below 140°C to prevent any permanent damage. Therefore, thermal analysis for the chosen application is very important to guarantee reliable performance over all conditions. The junction temperature of the die is the sum of the ambient temperature of the environment and the tempera- ture rise of the package due to the power dissipation, as shown in Equation 2. To guarantee reliable operation, the junction temperature of the ADP320 triple LDO must not exceed 125°C. To ensure that the junction temperature stays below this maximum value, the user needs to be aware of the parameters that contribute to junction temperature changes. These parameters include ambient tem- perature, power dissipation in the power device, and thermal resistances between the junction and ambient air (θJA). The θJA number is dependent on the package assembly compounds used and the amount of copper to which the GND pins of the package are soldered on the PCB. Table 6 shows typical θJA values for the ADP320 triple LDO for various PCB copper sizes. Table 6. Typical θJA Values Copper Size (mm2) ADP320 Triple LDO (°C/W) JEDEC1 49.5 100 83.7 500 68.5 1000 64.7 1 Device soldered to JEDEC standard board. The junction temperature of the ADP320 triple LDO can be calculated from the following equation: TJ = TA + (PD × θJA) (2) where: TA is the ambient temperature. PD is the power dissipation in the die, given by PD = Σ[(VIN − VOUT) × ILOAD] + Σ(VIN × IGND) (3) where: ILOAD is the load current. IGND is the ground current. VIN and VOUT are input and output voltages, respectively. Power dissipation due to ground current is quite small and can be ignored. Therefore, the junction temperature equation simplifies to TJ = TA + {Σ[(VIN − VOUT) × ILOAD] × θJA} (4) As shown in Equation 4, for a given ambient temperature, input-to-output voltage differential, and continuous load current, there exists a minimum copper size requirement for the PCB to ensure the junction temperature does not rise above 125°C. Figure 47 to Figure 50 show junction temperature calculations for different ambient temperatures, total power dissipation, and areas of PCB copper. In cases where the board temperature is known, the thermal characterization parameter, ΨJB, may be used to estimate the junction temperature rise. TJ is calculated from TB and PD using the formula TJ = TB + (PD × ΨJB) (5) The typical ΨJB value for the 16-lead 3 mm × 3 mm LFCSP is 25.2°C/W. |
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