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ZXMS6005DT8 датащи(PDF) 3 Page - Diodes Incorporated

номер детали ZXMS6005DT8
подробное описание детали  60V N-CHANNEL SELF PROTECTED ENHANCEMENT MODE INTELLIFET??MOSFET
PDF  9 Pages
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производитель  DIODES [Diodes Incorporated]
домашняя страница  http://www.diodes.com
Logo DIODES - Diodes Incorporated

ZXMS6005DT8 датащи(HTML) 3 Page - Diodes Incorporated

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ZXMS6005DT8
Document Number DS32248 Rev. 1 - 2
3 of 9
www.diodes.com
June 2010
© Diodes Incorporated
A Product Line of
Diodes Incorporated
ABSOLUTE MAXIMUM RATINGS
PARAMETER
SYMBOL
LIMIT
UNIT
Continuous Drain-Source Voltage
VDS
60
V
Drain-Source Voltage for short circuit protection
VDS(SC)
24
V
Continuous Input Voltage
VIN
-0.5 ... +6
V
Continuous Input Current
-0.2V
≤VIN≤6V
VIN<-0.2V or VIN>6V
IIN
No limit
│IIN │≤2
mA
Operating Temperature Range
Tj,
-40 to +150
°C
Storage Temperature Range
Tstg
-55 to +150
°C
Power Dissipation at TA =25°C (a)(d)
Linear Derating Factor
PD
1.16
9.28
W
mW/
°C
Power Dissipation at TA =25°C (a)(e)
Linear Derating Factor
PD
1.67
13.3
W
mW/
°C
Power Dissipation at TA =25°C (b)(d)
Linear Derating Factor
PD
2.13
17
W
mW/
°C
Pulsed Drain Current @ VIN=3.3V
IDM
5
A
Pulsed Drain Current @ VIN=5V
IDM
6
A
Continuous Source Current (Body Diode) (a)
IS
2.5
A
Pulsed Source Current (Body Diode)
ISM
10
A
Unclamped single pulse inductive energy, Tj=25
°C,
ID=0.5A, VDD=24V
EAS
210
mJ
Electrostatic Discharge (Human Body Model)
VESD
4000
V
Charged Device Model
VCDM
1000
V
THERMAL RESISTANCE
PARAMETER
SYMBOL
VALUE
UNIT
Junction to Ambient (a)(d)
RθJA
108
°C/W
Junction to Ambient (a)(e)
RθJA
75
°C/W
Junction to Ambient (b)(d)
RθJA
58.7
°C/W
Junction to Case (f)
RθJC
26.5
°C/W
NOTES
(a) For a dual device surface mounted on a 25mm x 25mm single sided 1oz weight copper split down the
middle on 1.6mm FR4 board, in still air conditions.
(b) For a dual device surface mounted on FR4 PCB measured at t
≤ 10sec
(c) Repetitive rating25mm x 25mm FR4 PCB, D=0.02, Pulse width=300µs – pulse width limited by junction
temperature. Refer to transient thermal impedance graph.
(d) For a dual device with one active die.
(e) For a dual device with 2 active die running at equal power.
(f)
Thermal resistance from junction to the mounting surface of the drain pin.



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