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LTC4280CUFD датащи(PDF) 18 Page - Linear Technology |
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LTC4280CUFD датащи(HTML) 18 Page - Linear Technology |
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18 / 28 page ![]() LTC4280 18 4280f APPLICATIONS INFORMATION of R5 resistance, the absence of a drain bypass capacitor, a combination of bus wiring inductance and bus supply output impedance. To prevent this second type of oscillation avoid load capacitance below 10μF, alternately connect an external capacitor from the MOSFET gate to ground with a value greater than 1.5μF. Supply Transients The LTC4280 is designed to ride through supply transients caused by load steps. If there is a shorted load and the parasitic inductance back to the supply is greater than 0.5μH, there is a chance that the supply collapses before the active current limit circuit brings down the GATE pin. If this occurs, the undervoltage monitors pull the GATE pin low. The undervoltage lockout circuit has a 2μs filter time after VDD drops below 2.74V. The UV pin reacts in 2μs to shut the GATE off, but it is recommended to add a filter capacitor CF to prevent unwanted shutdown caused by a transient. Eventually either the UV pin or undervoltage lockout responds to bring the current under control before the supply completely collapses. Supply Transient Protection The LTC4280 is safe from damage with supply voltages up to 24V. However, spikes above 24V may damage the part. During a short-circuit condition, large changes in current flowing through power supply traces may cause inductive voltage spikes which exceed 24V. To minimize such spikes, the power trace inductance should be minimized by using wider traces or heavier trace plating. Also, a snubber circuit dampens inductive voltage spikes. Build a snubber by using a 100Ω resistor in series with a 0.1μF capacitor between VDD and GND. A surge suppressor, Z1 in Figure 1, at the input can also prevent damage from voltage surges. Design Example As a design example, take the following specifications: VIN = 12V, IMAX = 5A, IINRUSH = 1A, 5ms FILTER time, CL=330μF,VUV(ON)=10.75V,VOV(OFF)=14.0V,VPWRGD(UP) = 11.6V, and I2C ADDRESS = 1010011. This completed design is shown in Figure 1. Selection of the sense resistor, RS, is set by the overcurrent threshold of 25mV: R mV I S MAX == 25 0 005 . Ω The MOSFET is sized to handle the power dissipation during inrush when output capacitor COUT is being charged. A method to determine power dissipation during inrush is based on the principle that: Energy in CL = Energy in Q1 This uses: Energy in CL == ()( ) 1 2 1 2 033 12 2 2 CV mF . or 0.024 joules. Calculate the time it takes to charge up COUT: tC V I mF V A ms STARTUP L DD INRUSH == = •. • 033 12 1 4 The power dissipated in the MOSFET: P t W DISS STARTUP == Energy in CL 6 TheSOA(safeoperatingarea)curvesofcandidateMOSFETs must be evaluated to ensure that the heat capacity of the package tolerates 6W for 4ms. The SOA curves of the Fairchild FDC653N provide for 2A at 12V (24W) for 10ms, satisfying this requirement. Since the FDC653N has less than 8μF of gate capacitance and we are using a GATE RC network, the short-circuit stability of the current limit should be checked and improved by adding a capacitor from GATE to SOURCE if needed. The inrush current is set to 1A using C1: CC I I CmF μA A or C L GATE INRUSH 1 10 33 20 1 16 = == • .• .8 8nF |
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