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LT1766/LT1766-5

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PACKAGE DESCRIPTION

FE Package

16-Lead Plastic TSSOP (4.4mm)

(Reference LTC DWG # 05-08-1663)

Exposed Pad Variation BB

GN Package

16-Lead Plastic SSOP (Narrow .150 Inch)

(Reference LTC DWG # 05-08-1641)

FE16 (BB) TSSOP 0204

0.09 – 0.20

(.0035 – .0079)

0 – 8

0.25

REF

0.50 – 0.75

(.020 – .030)

4.30 – 4.50*

(.169 – .177)

1.10

(.0433)

MAX

0.05 – 0.15

(.002 – .006)

0.65

(.0256)

BSC

0.195 – 0.30

(.0077 – .0118)

TYP

MILLIMETERS

(INCHES)

*DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH

SHALL NOT EXCEED 0.150mm (.006") PER SIDE

NOTE:

1. CONTROLLING DIMENSION: MILLIMETERS

2. DIMENSIONS ARE IN

3. DRAWING NOT TO SCALE

RECOMMENDED SOLDER PAD LAYOUT

0.45 0.05

0.65 BSC

4.50 0.10

6.60 0.10

1.05 0.10

2.94

(.116)

3.58

(.141)

SEE NOTE 4

4. RECOMMENDED MINIMUM PCB METAL SIZE

FOR EXPOSED PAD ATTACHMENT

5 6 7 8

4.90 – 5.10*

(.193 – .201)

16 1514 13 12 11

2.94

(.116)

3.58

(.141)

6.40

(.252)

BSC

GN16 (SSOP) 0204

.016 – .050

(0.406 – 1.270)

.015

.004

(0.38

0.10)

0 – 8 TYP

.007 – .0098

(0.178 – 0.249)

.0532 – .0688

(1.35 – 1.75)

.008 – .012

(0.203 – 0.305)

TYP

.004 – .0098

(0.102 – 0.249)

.0250

(0.635)

BSC

.229 – .244

(5.817 – 6.198)

.150 – .157**

(3.810 – 3.988)

16 15 14 13

.189 – .196*

(4.801 – 4.978)

12 11 10 9

.009

(0.229)

REF

.254 MIN

RECOMMENDED SOLDER PAD LAYOUT

.150 – .165

.0250 BSC

.0165 .0015

.045 .005

*DIMENSION DOES NOT INCLUDE MOLD FLASH. MOLD FLASH

SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE

**DIMENSION DOES NOT INCLUDE INTERLEAD FLASH. INTERLEAD

FLASH SHALL NOT EXCEED 0.010" (0.254mm) PER SIDE

INCHES

(MILLIMETERS)

NOTE:

1. CONTROLLING DIMENSION: INCHES

2. DIMENSIONS ARE IN

3. DRAWING NOT TO SCALE

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