PBSS302ND_2

© NXP B.V. 2008. All rights reserved.

Product data sheet

Rev. 02 — 18 February 2008

4 of 14

NXP Semiconductors

PBSS302ND

6.

Thermal characteristics

[1]

Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.

[2]

[3]

[4]

[5]

Operated under pulsed conditions: Duty cycle

δ≤ 10 % and pulse width t

Table 6.

Thermal characteristics

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

thermal resistance from

junction to ambient

in free air

[1] -

-

350

K/W

[2] -

-

208

K/W

[3] -

-

167

K/W

[4] -

-

113

K/W

[1][5] --50

K/W

thermal resistance from

junction to solder point

--45

K/W

FR4 PCB, standard footprint

Fig 2.

Transient thermal impedance from junction to ambient as a function of pulse duration; typical values

006aaa271

10

1

(K/W)

10

1

duty cycle =

1

0.75

0.5

0.33

0.2

0.1

0.05

0.02

0.01

0