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IP4085CX4/LF датащи(PDF) 14 Page - NXP Semiconductors |
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IP4085CX4/LF датащи(HTML) 14 Page - NXP Semiconductors |
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14 / 16 page ![]() IP4085_4385_4386_4387_CX4_1 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 — 26 March 2009 14 of 16 NXP Semiconductors IP4085/4385/4386/4387/CX4 Integrated high-performance ESD-protection diodes 12. Abbreviations 13. Revision history Table 8. Reflow soldering process characteristics Symbol Parameter Conditions Min Typ Max Unit Treflow(peak) peak reflow temperature 230 - 260 °C t1 time 1 soak time 60 - 180 s t2 time 2 time during T ≥ 250 °C --30 s t3 time 3 time during T ≥ 230 °C 10 - 50 s t4 time 4 time during T > 217 °C 30 - 150 s t5 time 5 - - 540 s dT/dt rate of change of temperature cooling rate - - −6 °C/s pre-heat 2.5 - 4.0 °C/s Table 9. Abbreviations Acronym Description DUT Device Under Test FR4 Flame Retard 4 LAN Local Area Network PCB Printed-Circuit Board PCS Personal Communication System RoHS Restriction of Hazardous Substances WAN Wide Area Network WLCSP Wafer-Level Chip-Scale Package Table 10. Revision history Document ID Release date Data sheet status Change notice Supersedes IP4085_4385_4386_4387_CX4_1 20090326 Product data sheet - - |
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