IP4085_4385_4386_4387_CX4_1

© NXP B.V. 2009. All rights reserved.

Product data sheet

Rev. 01 — 26 March 2009

2 of 16

NXP Semiconductors

IP4085/4385/4386/4387/CX4

Integrated high-performance ESD-protection diodes

2.

Pinning information

3.

Ordering information

4.

Functional diagram

Fig 1.

Pin configuration IP4085CX4; IP4385CX4; IP4386CX4; IP4387CX4

Table 1.

Pinning

Pin

Description

A1 and A2

diode cathode

B1 and B2

diode anode

001aaj238

IP4085CX4

IP438xCX4

Transparent top view

B

A

2

1

ball A1

index area

Table 2.

Ordering information

Type number

Package

Name

Description

Version

IP4085CX4/LF

WLCSP4

wafer level chip-size package: 4 bumps; 0.91

× 0.91 × 0.65 mm

IP4085CX4/LF

IP4385CX4/LF

WLCSP4

wafer level chip-size package: 4 bumps; 0.76

× 0.76 × 0.61 mm

IP438xCX4/LF

IP4386CX4/LF

WLCSP4

wafer level chip-size package: 4 bumps; 0.76

× 0.76 × 0.61 mm

IP438xCX4/LF

IP4387CX4/LF

WLCSP4

wafer level chip-size package: 4 bumps; 0.76

× 0.76 × 0.61 mm

IP438xCX4/LF

Fig 2.

Schematic diagram IP4085CX4; IP4385CX4; IP4386CX4; IP4387CX4

001aaj239

A1

B1

A2

B2