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NX2139A датащи(PDF) 17 Page - Microsemi Corporation

номер детали NX2139A
подробное описание детали  SINGLE CHANNEL MOBILE PWM AND LDO CONTROLLER
PDF  21 Pages
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производитель  MICROSEMI [Microsemi Corporation]
домашняя страница  http://www.microsemi.com
Logo MICROSEMI - Microsemi Corporation

NX2139A датащи(HTML) 17 Page - Microsemi Corporation

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NX2139A
17
Rev. 2.3
03/19/09
5. Source of the lower MOSFET needs to be con-
nected to the GND plane with multiple vias. One is not
enough. This is very important. The same applies to
the output capacitors and input capacitors.
6. Hdrv and Ldrv pins should be as close to
MOSFET gate as possible. The gate traces should be
wide and short. A place for gate drv resistors is needed
to fine tune noise if needed.
7. Vcc capacitor, BST capacitor or any other by-
passing capacitor needs to be placed first around the
IC and as close as possible. The capacitor on comp to
GND or comp back to FB needs to be place as close to
the pin as well as resistor divider.
8. The output sense line which is sensing output
back to the resistor divider should not go through high
frequency signals, should be kept away from the in-
ductor and other noise sources. The resistor divider
must be located as close as possible to the FB pin of
the device.
9. All GNDs need to go directly thru via to GND
plane.
10. In multilayer PCB, separate power ground
and analog ground. These two grounds must be con-
nected together on the PC board layout at a single point.
The goal is to localize the high current path to a sepa-
rate loop that does not interfere with the more sensi-
tive analog control function.



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