ABSOLUTE MAXIMUM RATINGS

(1)

DISSIPATION RATINGS

THS6214

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

SPECIFIED

PACKAGE

TEMPERATURE

PACKAGE

ORDERING

TRANSPORT

PRODUCT

DESIGNATOR

RANGE

MARKING

NUMBER

MEDIA, QUANTITY

THS6214IRHFT

Tape and reel, 250

THS6214

QFN-24

RHF

–40°C to +85°C

6214

THS6214IRHFR

Tape and reel, 3000

THS6214IPWP

Tape and reel, 60

THS6214

TSSOP-24

PWP

–40°C to +85°C

THS6214

THS6214IPWPR

Tape and reel, 2000

(1)

For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI

web site at www.ti.com.

(2)

The PowerPAD™ is electrically isolated from all other pins.

Over operating free-air temperature range, unless otherwise noted.

THS6214

UNIT

28

V

V

±2

V

(2)

±500

mA

Continuous power dissipation

See Dissipation Ratings Table

+150

°C

Maximum junction

+130

°C

RHF package only

+140

°C

PWP package only

–65 to +150

°C

Human body model (HBM)

2000

V

ESD ratings

Charged device model (CDM)

500

V

Machine model (MM)

100

V

(1)

Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated is not implied. Exposure to absolute

maximum rated conditions for extended periods may degrade device reliability.

(2)

The THS6214 incorporates a PowerPAD on the underside of the chip. This pad acts as a heatsink and must be connected to a

thermally dissipating plane for proper power dissipation. Failure to do so may result in exceeding the maximum junction temperature,

which could permanently damage the device. See TI Technical Brief SLMA002 for more information about utilizing the PowerPAD

thermally-enhanced package. Under high-frequency ac operation (greater than 10kHz), the short-term output current capability is much

greater than the continuous dc output current rating. This short-term output current rating is about 8.5 times the dc capability, or about

±850mA.

(3)

The absolute maximum junction temperature under any condition is limited by the constraints of the silicon process.

(4)

The absolute maximum junction temperature for continuous operation is limited by the package constraints. Operation above this

temperature may result in reduced reliability and/or lifetime of the device.

PACKAGE

θ

θ

(1)

QFN-24 (RHF)

5

30

HTSSOP-24 (PWP)

7

45

(1)

For high power dissipation applications, soldering the PowerPAD to the PCB is required. Failure to do so may result in reduced reliability

and/or lifetime of the device. See TI technical brief SLMA002 for more information about using the PowerPAD thermally enhanced

package.

2

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