TMP320C40KGDC, SMJ320C40KGDC, TMP320C40KGDCT, SMJ320C40KGDCT

FLOATING-POINT DIGITAL SIGNAL PROCESSOR

KNOWN GOOD DIES

SGUS024B – MARCH 1997 – REVISED APRIL 2000

5

POST OFFICE BOX 1443

’320C40 (rev 5.2) known good die pad information

325

244

Die Side Number 4

Pad Number One

1

•

•

•

Die Side Number 1

•

•

•

81

Zero-Zero

(origin)

82

162

Die Side Number 2

243

•

•

•

Die Side Number 3

•

•

•

163

Die Designator

Figure 2. ’320C40 Die Numbering Format

(See Table 1)

Table 1 provides a reference for the following:

In addition, the following notes are significant:

A.

X,Y coordinate data is in microns.

B.

The active silicon dimensions are 12 424.86

µm × 12035.52 µm (489.16 mils × 473.83 mils).

C.

The die size is approximately 12 598.40

µm × 12192.00 µm (496.00 mils × 480.00 mils).

D.

Bond pad dimensions are 108.00

µm × 108.00 µm (4.25 mils × 4.25 mils).

E.

Center of bond pad to edge of die min (without scribe) = 107.80

µm (4.24 mils).

F.

For R-Tab devices, gold bump dimensions are approximately 92

µm × 92 µm (3.62 mils × 3.62 mils).

G.

Coordinate origin is at (0,0) (center of bond pad 82).