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TMP320C40KGDCT датащи(PDF) 4 Page - Texas Instruments

номер детали TMP320C40KGDCT
подробное описание детали  FLOATING-POINT DIGITAL SIGNAL PROCESSOR KNOWN GOOD DIES
PDF  14 Pages
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производитель  TI [Texas Instruments]
домашняя страница  http://www.ti.com
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TMP320C40KGDCT датащи(HTML) 4 Page - Texas Instruments

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TMP320C40KGDC, SMJ320C40KGDC, TMP320C40KGDCT, SMJ320C40KGDCT
FLOATING-POINT DIGITAL SIGNAL PROCESSOR
KNOWN GOOD DIES
SGUS024B – MARCH 1997 – REVISED APRIL 2000
4
POST OFFICE BOX 1443
HOUSTON, TEXAS 77251–1443
SMJ
320
C
40
M
KGD
50
PREFIX
SMJ =
MIL-PRF-38535 Processing
TMP =
Commercial Level
DEVICE FAMILY
320 = DSP Family
TECHNOLOGY
C = CMOS
DEVICE
40 = Floating-Point DSP
SPEED RANGE
40 = 40 MHz
50 = 50 MHz
PACKAGE TYPE
KGD = Known Good Die
TEMPERATURE RANGE
M (Military)
=
–55
°C to 125°C
L (Commercial) =
0
°Cto 70°C
C
DIE REVISION
C
= Revision 5.2
T
KGD OPTION
T
= TWB process
blank = R-Tab process
Figure 1. TMP / SMJ320C40KGD Device Nomenclature
JEDEC STANDARD
D Die thickness is approximately 15 mils ± 1 mil.
D Backside surface finish is silicon.
D Maximum allowable die junction operating temperature is 175°C.
D Glassivation material is compressive nitride.
D Bond pad metal is composed of copper-doped aluminum.
D Percent defective allowed for burned-in die is 5.
D Life test data is available.
D Configuration control notification.
D Group A attribute summary is available (SMJ only).
D Suggested die-attach material is silver glass (QMI 2569F).
D Suggested bond wire size is 1.25 mil.
D For gold bumped KGD die, suggested bonding method is gold-ball bonding.
D ESD rating is Class II.
D Maximum allowable peak process temperature for die-attach is 440°C ± 5°C (for QMS2569F)
D Saw kerf is dependent on blade size used.
D Die backside potential is left floating.



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