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PCF8576DT/2 датащи(PDF) 47 Page - NXP Semiconductors |
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PCF8576DT/2 датащи(HTML) 47 Page - NXP Semiconductors |
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47 / 52 page ![]() PCF8576D_7 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 7 — 18 December 2008 47 of 52 NXP Semiconductors PCF8576D Universal LCD driver for low multiplex rates • Solder paste printing issues, such as smearing, release, and adjusting the process window for a mix of large and small components on one board • Reflow temperature profile; this profile includes preheat, reflow (in which the board is heated to the peak temperature), and cooling down. It is imperative that the peak temperature is high enough for the solder to make reliable solder joints (a solder paste characteristic) while being low enough that the packages and/or boards are not damaged. The peak temperature of the package depends on package thickness and volume and is classified in accordance with Table 24 Moisture sensitivity precautions, as indicated on the packing, must be respected at all times. Studies have shown that small packages reach higher temperatures during reflow soldering, see Figure 32. For further information on temperature profiles, refer to application note AN10365 “Surface mount reflow soldering description”. 18.3.1 Stand off The stand off between the substrate and the chip is determined by: • The amount of printed solder on the substrate • The size of the solder land on the substrate Table 25. Lead-free process (from J-STD-020C) Package thickness (mm) Package reflow temperature ( °C) Volume (mm3) < 350 350 to 2000 > 2000 < 1.6 260 260 260 1.6 to 2.5 260 250 245 > 2.5 250 245 245 MSL: Moisture Sensitivity Level Fig 32. Temperature profiles for large and small components 001aac844 temperature time minimum peak temperature = minimum soldering temperature maximum peak temperature = MSL limit, damage level peak temperature |
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