74LVT_LVTH574_4

© NXP B.V. 2008. All rights reserved.

Product data sheet

Rev. 04 — 11 September 2008

13 of 16

NXP Semiconductors

74LVT574; 74LVTH574

3.3 V octal D-type flip-flop; 3-state

Fig 14. Package outline SOT764-1 (DHVQFN20)

terminal 1

index area

0.5

1

A1

Eh

b

UNIT

y

e

0.2

c

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

JEITA

mm

4.6

4.4

Dh

3.15

2.85

y1

2.6

2.4

1.15

0.85

e1

3.5

0.30

0.18

0.05

0.00

0.05

0.1

DIMENSIONS (mm are the original dimensions)

SOT764-1

MO-241

- - -

- - -

0.5

0.3

L

0.1

v

0.05

w

0

2.5

5 mm

scale

SOT764-1

DHVQFN20: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads;

20 terminals; body 2.5 x 4.5 x 0.85 mm

max.

A

A1

c

detail X

y

y1 C

e

L

Eh

Dh

e

e1

b

29

19

12

11

10

1

20

X

D

E

C

B

A

terminal 1

index area

A

C

C

B

Note

1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.

02-10-17

03-01-27