74LVT_LVTH574_4

© NXP B.V. 2008. All rights reserved.

Product data sheet

Rev. 04 — 11 September 2008

10 of 16

NXP Semiconductors

74LVT574; 74LVTH574

3.3 V octal D-type flip-flop; 3-state

12. Package outline

Fig 11. Package outline SOT163-1 (SO20)

UNIT

A

max.

cD

(1)

E

(1)

(1)

Q

Z

y

w

v

θ

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

JEITA

mm

inches

2.65

0.3

0.1

2.45

2.25

0.49

0.36

0.32

0.23

13.0

12.6

7.6

7.4

1.27

10.65

10.00

1.1

1.0

0.9

0.4

8

0

o

o

0.25

0.1

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Note

1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.

1.1

0.4

SOT163-1

10

20

detail X

Z

e

11

1

D

y

0.25

075E04

MS-013

pin 1 index

0.1

0.012

0.004

0.096

0.089

0.019

0.014

0.013

0.009

0.51

0.49

0.30

0.29

0.05

1.4

0.055

0.419

0.394

0.043

0.039

0.035

0.016

0.01

0.25

0.01

0.004

0.043

0.016

0.01

0

5

10 mm

scale

X

θ

A

Q

E

c

L

(A )

3

A

SO20: plastic small outline package; 20 leads; body width 7.5 mm

SOT163-1

99-12-27

03-02-19