33742 datasheet(69/70 Pages) FREESCALE

69 / 70 page

Analog Integrated Circuit Device Data

Freescale Semiconductor

33742

REVISION HISTORY

REVISION

DATE

DESCRIPTION OF CHANGES

2/2006

• Converted to Freescale format

• Implemented Revision History page

6/2006

• Added Thermal Addendum (Rev. 1.0)

• Changed Data Sheet from “Advanced” to “Final”

8/2006

• Added MCZ33742EG/R2 and MCZ33742SEG/R2 to the Ordering Information block

8/2006

• Replaced label for Logic Inputs to Logic Signals (RXD, TXD, MOSI, MISO, CS, SCLK, RST,

WDOG, and INT) on page 7

10/2006

• Removed all references to the 54 pin package.

• Removed Peak Package Reflow Temperature During Reflow (solder reflow) parameter from

Maximum Ratings on page 7. Added note with instructions from www.freescale.com.

2/2007

• Revised () and (),

• Restated notes in Maximum Ratings on page 7

3/2007

• Text corrections to the included thermal addendum

5/2007

• Added EP 48 pin QFN package

• Added 98ARH99048A Package drawing

• Added PCZ33742EP/R2 to the ordering information

6/2008

• Made changes defining RXD as a push-pull structure on page 16, 23, 38, and 39

• Updated figures Figure 12 and Figure 25

• Added provisions of differentiation for 28-pin SOIC and 48-pin QFN for ESD Capability,

Human Body Model(1) on page 7, Watchdog Period Normal and Standby Modes on page 18,

and Normal Request Mode Timeout on page 18

• Update the Freescale format and style to the current standards

• Added the Functional Internal Block Description section

• Changed PCZ33742EP/R2 to MC33742EP/R2 in the ordering information

33742 датащи(PDF) 69 Page - Freescale Semiconductor, Inc