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CMV8000 датащи(PDF) 87 Page - ams-OSRAM AG |
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CMV8000 датащи(HTML) 87 Page - ams-OSRAM AG |
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87 / 90 page ![]() Document Feedback CMV8000 Soldering & Storage Information Preliminary Datasheet • PUBLIC DS000609 • v1-00 • 2019-Jun-12 89 │ 86 11 Soldering & Storage Information Attention Image sensors with color filter arrays and micro lenses are particularly sensitive to high temperatures. Prolonged heating at elevated temperatures may result in deterioration of the optical performance of the sensor. A socket is the safest way to avoid any thermal stress. When not using a socket, we recommend to use manual hand soldering. Wave soldering can be used with precautions. Reflow soldering is not recommended. Manual Soldering: Use partial heating method and use a soldering iron with temperature control. The soldering iron tip temperature is not to exceed 350 °C with a 270 °C maximum pin temperature. Touch for a 2 seconds maximum duration per pin. Avoid touching and global heating of the ceramic package during soldering. Failure to do so may later device performance and reliability. Wave Soldering: Wave solder dipping can cause damage to the glass and harm the imaging capability of the device. Avoid the solder to come in contact with the glass or ceramic body. Figure 140: Solder Reflow Profile Graph |
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