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STM32F101C4 датащи(PDF) 82 Page - STMicroelectronics

номер детали STM32F101C4
подробное описание детали  Low-density access line, ARM®-based 32 bit MCU with 16 or 32 KB Flash, 5 timers, ADC and 4 communication interfaces
PDF  87 Pages
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производитель  STMICROELECTRONICS [STMicroelectronics]
домашняя страница  http://www.st.com
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STM32F101C4 датащи(HTML) 82 Page - STMicroelectronics

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Package characteristics
STM32F101x4, STM32F101x6
82/87
DocID15058 Rev 6
6.5
Thermal characteristics
The maximum chip junction temperature (TJmax) must never exceed the values given in
Table 8: General operating conditions on page 31.
The maximum chip-junction temperature, TJ max, in degrees Celsius, may be calculated
using the following equation:
TJ max = TA max + (PD max x ΘJA)
Where:
•
TA max is the maximum ambient temperature in ° C,
•ΘJA is the package junction-to-ambient thermal resistance, in ° C/W,
•
PD max is the sum of PINT max and PI/O max (PD max = PINT max + PI/Omax),
•
PINT max is the product of IDD and VDD, expressed in Watts. This is the maximum chip
internal power.
PI/O max represents the maximum power dissipation on output pins where:
PI/O max = Σ (VOL × IOL) + Σ((VDD – VOH) × IOH),
taking into account the actual VOL / IOL and VOH / IOH of the I/Os at low and high level in the
application.
6.5.1
Reference document
JESD51-2 Integrated Circuits Thermal Test Method Environment Conditions - Natural
Convection (Still Air). Available from www.jedec.org.
Table 49. Package thermal characteristics
Symbol
Parameter
Value
Unit
ΘJA
Thermal resistance junction-ambient
LQFP 64 - 10 x 10 mm / 0.5 mm pitch
45
°C/W
Thermal resistance junction-ambient
LQFP 48 - 7 x 7 mm / 0.5 mm pitch
55
Thermal resistance junction-ambient
UFQFPN 48 - 6 x 6 mm / 0.5 mm pitch
32
Thermal resistance junction-ambient
VFQFPN 36 - 6 x 6 mm / 0.5 mm pitch
18



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