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MPC8245 датащи(PDF) 31 Page - Freescale Semiconductor, Inc |
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MPC8245 датащи(HTML) 31 Page - Freescale Semiconductor, Inc |
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31 / 68 page ![]() MPC8245 Integrated Processor Hardware Specifications, Rev. 10 Freescale Semiconductor 31 Package Description Figure 23. Test Access Port Timing Diagram 5 Package Description This section details package parameters, pin assignments, and dimensions. 5.1 Package Parameters The MPC8245 uses a 35 mm × 35 mm, cavity-up, 352-pin tape ball grid array (TBGA) package. The package parameters are as follows. Package Outline 35 mm × 35 mm Interconnects 352 Pitch 1.27 mm Solder Balls ZU (TBGA package)—62 Sn/36 Pb/2 Ag VV (Lead-free version of package)—95.5 Sn/4.0 Ag/0.5 Cu Solder Ball Diameter 0.75 mm Maximum Module Height 1.65 mm Co-Planarity Specification 0.15 mm Maximum Force 6.0 lbs. total, uniformly distributed over package (8 grams/ball) 10 11 Input Data Valid 12 13 Output Data Valid TCK TDI, TMS TDO TDO |
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