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AT25DF512C датащи(PDF) 46 Page - Renesas Technology Corp |
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AT25DF512C датащи(HTML) 46 Page - Renesas Technology Corp |
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46 / 47 page ![]() DS-AT25DF512C-030 Rev.H Page 46 2024-01-08 © 2024 Renesas Electronics AT25DF512C Datasheet 18. Revision History Revision Level – Release Date History A – April 2014 Initial release. Document posted to public website. B – October 2014 Corrected 8S1 and 8MA3 package outline drawings. Updated IUDPD description in Table 13.3. Removed tray shipping option. Updated last byte address in Section 7.2. Updated AC and DC specifications. Updated document status to Preliminary. C – February 2015 Added Die in Wafer Form (DWF) ordering option. Added IDPD specification footnote. D – November 2015 Updated IDPD and ISP specification conditions. Updated document status from Preliminary to Complete. E – February 2017 Added patent information. Updated desccription in Section 8.2 (Page Erase). Updated Power-On Timing description (Section 14). F – December 2021 Updated drawing in Section 17.2. G – February 2022 Changed company logo to Renesas. H – January 2024 Applied new corporate template to document. Corrected the page address range in Figure 5. |
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