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TUSB1210 датащи(PDF) 2 Page - Texas Instruments

номер детали TUSB1210
подробное описание детали  TUSB1210 Stand-Alone USB Transceiver Chip Silicon
PDF  72 Pages
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производитель  TI2 [Texas Instruments]
домашняя страница  https://www.ti.com
Logo TI2 - Texas Instruments

TUSB1210 датащи(HTML) 2 Page - Texas Instruments

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Table of Contents
1 Features............................................................................1
2 Applications..................................................................... 1
3 Description.......................................................................1
4 Revision History.............................................................. 2
5 Pin Configuration and Functions...................................4
6 Specifications.................................................................. 6
6.1 Absolute Maximum Ratings........................................ 6
6.2 ESD Ratings............................................................... 6
6.3 Recommended Operating Conditions.........................6
6.4 Thermal Information....................................................7
6.5 Analog I/O Electrical Characteristics...........................7
6.6 Digital I/O Electrical Characteristics............................7
6.7 Digital IO Pins (Non-ULPI).......................................... 7
6.8 PHY Electrical Characteristics.................................... 8
6.9 Pullup/Pulldown Resistors........................................ 10
6.10 OTG Electrical Characteristics................................10
6.11 OTG ID Electrical.....................................................11
6.12 Power Characteristics............................................. 11
6.13 Switching Characteristics........................................12
6.14 Timing Requirements..............................................13
6.15 Typical Characteristics............................................ 15
7 Detailed Description......................................................16
7.1 Overview................................................................... 16
7.2 Functional Block Diagram......................................... 16
7.3 Feature Description...................................................17
7.4 Device Functional Modes..........................................20
7.5 Register Map.............................................................22
8 Application and Implementation.................................. 53
8.1 Application Information............................................. 53
8.2 Typical Application.................................................... 53
8.3 External Components............................................... 57
9 Power Supply Recommendations................................58
9.1 TUSB1210 Power Supply......................................... 58
9.2 Ground...................................................................... 58
9.3 Power Providers........................................................58
9.4 Power Modules......................................................... 58
9.5 Power Consumption..................................................59
10 Layout...........................................................................60
10.1 TUSB121x USB2.0 Product Family Board
Layout Recommendations...........................................60
10.2 Layout Guidelines................................................... 62
10.3 Layout Example...................................................... 62
11 Device and Documentation Support..........................63
11.1 Device Support........................................................63
11.2 Documentation Support.......................................... 63
11.3 Receiving Notification of Documentation Updates.. 63
11.4 Support Resources................................................. 63
11.5 Trademarks............................................................. 63
11.6 Electrostatic Discharge Caution.............................. 63
11.7 Glossary.................................................................. 63
12 Mechanical, Packaging, and Orderable
Information.................................................................... 63
4 Revision History
Changes from Revision I (December 2019) to Revision J (July 2021)
Page
• Updated the numbering format for tables, figures, and cross-references throughout the document..................1
• Changed the tDC, tDD OUTPUT CLOCK delay value From: MAX = 9 ns To: MAX = 5 ns in the Timing
Requirements .................................................................................................................................................. 13
• Changed the tDC, tDD OUTPUT CLOCK delay value From: MIN = blank To: MIN = 1.2 ns in the Timing
Requirements .................................................................................................................................................. 13
• Added the Related Documentation section...................................................................................................... 63
Changes from Revision H (June 2015) to Revision I (December 2019)
Page
• Changed the document from a data manual format to a TI data sheet format .................................................. 1
• Changed RHB Package 32-Pin OFN To: RHB Package 32-Pin VQFN in Pin Configuration and Functions .....4
• Changed the HBM value From: ±2 V To : ±2000 V in the ESD Ratings ............................................................ 6
• Changed the tSC, tSD INPUT CLOCK value From: MAX = 3 ns To: MIN = 3 ns in the Timing Requirements ..13
• Changed the tSC, tSD OUTPUT CLOCK value From: MAX = 6 ns To: MIN = 6 ns in the Timing Requirements ..
13
• Deleted section Via Channel from the Mechanical Packaging and Orderable Information section .................63
Changes from Revision G (October 2014) to Revision H (June 2015)
Page
• Move Storage Temperature From: ESD Ratings To: Absolute Maximum Ratings .............................................6
• Changed the Handling Ratings table To: ESD Ratings ......................................................................................6
Changes from Revision F (July 2013) to Revision G (October 2014)
Page
• Added Pin Configuration and Functions section, ESD Rating table, Feature Description section, Device
Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout
TUSB1210
SLLSE09J – NOVEMBER 2009 – REVISED JULY 2021
www.ti.com
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Product Folder Links: TUSB1210



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