Table 4-2. LM50 and LM50HV Devices Orderable Options

DEVICE NAME

PART NUMBER

ACCURACY OVER

TEMPERATURE

SPECIFIED TEMPERATURE

RANGE

SUPPLY RANGE

PACKAGE

LM50

LM50BIM3

-3.5°C/3°C

–25°C ≤ TA ≤ +100°C

4.5V to 10V

SOT-23

(DBZ)

3-pin

LM50BIM3X/NOPB 1

–25°C ≤ TA ≤ +100°C

(Legacy chip)

–40°C ≤ TA ≤ +125°C

(New chip)

LM50CIM3

±4°C

–40°C ≤ TA ≤ +125°C

LM50CIM3X

LM50CIM3X/NOPB

–40°C ≤ TA ≤ +125°C

(Both legacy & new chip)

LM50HV

LM50HVDBZR

±2°C

20°C ≤ TA ≤ +70°C

3V to 36V

±2.5°C

–10°C ≤ TA ≤ +125°C

±3.5°C

–40°C ≤ TA ≤ +125°C

±3°C

–20°C ≤ TA ≤ +150°C

±3.5°C

–40°C ≤ TA ≤ +150°C

1. LM50BIM3X/NOPB (Legacy chip) operates from –25°C to 100°C while LM50BIM3X/NOPB (New chip)

operates from –40°C to 125°C.

Table 4-3. LM50 and LM50HV Devices Nomenclature Detail

PRODUCT

DESCRIPTION

LM50xIyyy

x indicates that the device has B or C variant. These devices can ship with the legacy chip (CSO: GF6 or SHE)

or the new chip (CSO: RFB) with different chip source origin (CSO). The reel packaging label provides date code

information to distinguish which chip is being used. Device performance for new and legacy chips is denoted

throughout the document.

yyy indicates the package type of the device which can be M3, M3X and M3X/NOPB all in DBZ (SOT-23 3-pin).

LM50HVyyyR

LM50HV has only CSO: RFB.

yyy indicates that the package type of the device is DBZ (SOT-23 3-pin).

5 Pin Configuration and Functions

1

+V

S

V

O

GND

2

3

Figure 5-1. DBZ Package 3-Pin SOT-23 Top View

Table 5-1. Pin Functions

PIN

TYPE

DESCRIPTION

NO.

NAME

1

+VS

Power

Positive power supply pin.

2

VO

Output

Temperature sensor analog output.

3

GND

Ground

Device ground pin, connected to power supply negative terminal.

LM50, LM50HV

SNIS118I – JULY 1999 – REVISED OCTOBER 2025

www.ti.com

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