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LM35 датащи(PDF) 22 Page - Texas Instruments |
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LM35 датащи(HTML) 22 Page - Texas Instruments |
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22 / 33 page ![]() 8.5.2 Layout Example 1 +V S V O GND Via to ground plane Via to power plane 2 3 Figure 8-13. PCB Layout Figure 8-14. Printed-Circuit Board Used for Heat Sink to Generate Thermal Response Curves LM50 (Legacy Chip) 2 1 1 2 3 0.5" Figure 8-15. Printed-Circuit Board Used to Generate Thermal Response Curves [New Test Setup for LM50 (New Chip and Legacy Chip) and LM50HV] LM50, LM50HV SNIS118I – JULY 1999 – REVISED OCTOBER 2025 www.ti.com 22 Submit Document Feedback Copyright © 2025 Texas Instruments Incorporated Product Folder Links: LM50 LM50HV |
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