• Run thermal simulations to understand board thermal performance.

• Export customized schematic and layout into popular CAD formats.

• Print PDF reports for the design, and share the design with colleagues.

Get more information about WEBENCH tools at www.ti.com/WEBENCH.

11.2 Documentation Support

11.2.1 Related Documentation

For related documentation, see the following:

• Texas Instruments, Innovative DC/DC Power Modules selection guide

• Texas Instruments, Enabling Small, Cool and Quiet Power Modules with Enhanced HotRod™ QFN Package

Technology white paper

• Texas Instruments, Benefits and Trade-offs of Various Power-Module Package Options white paper

• Texas Instruments, Simplify Low EMI Design with Power Modules white paper

• Texas Instruments, Power Modules for Lab Instrumentation white paper

• Texas Instruments, An Engineer's Guide To EMI In DC/DC Regulators e-book

• Texas Instruments, Soldering Considerations for Power Modules application report

• Texas Instruments, Practical Thermal Design With DC/DC Power Modules application report

• Texas Instruments, Using New Thermal Metrics application report

• Texas Instruments, AN-2020 Thermal Design By Insight, Not Hindsight application report

• Texas Instruments, Using the TPSM53602/3/4 for Negative Output Inverting Buck-Boost Applications

application report

11.3 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on

Subscribe to updates to register and receive a weekly digest of any product information that has changed. For

change details, review the revision history included in any revised document.

11.4 Support Resources

TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight

from the experts. Search existing answers or ask your own question to get the quick design help you need.

Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do

not necessarily reflect TI's views; see TI's Terms of Use.

11.5 Trademarks

HotRod™ and TI E2E™ are trademarks of Texas Instruments.

WEBENCH® is a registered trademark of Texas Instruments.

is a registered trademark of Texas Instruments.

All trademarks are the property of their respective owners.

11.6 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled

with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may

be more susceptible to damage because very small parametric changes could cause the device not to meet its published

specifications.

11.7 Glossary

TI Glossary

This glossary lists and explains terms, acronyms, and definitions.

12 Mechanical, Packaging, and Orderable Information

The following pages include mechanical packaging and orderable information. This information is the most

current data available for the designated devices. This data is subject to change without notice and revision of

this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

TLVM13630

SLVSFT6B – MAY 2021 – REVISED JANUARY 2022

www.ti.com

36

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