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TAS5713 датащи(PDF) 67 Page - Texas Instruments

номер детали TAS5713
подробное описание детали  25-W DIGITAL AUDIO POWER AMPLIFIER WITH EQ AND DRC
PDF  72 Pages
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производитель  TI2 [Texas Instruments]
домашняя страница  https://www.ti.com
Logo TI2 - Texas Instruments

TAS5713 датащи(HTML) 67 Page - Texas Instruments

Back Button TAS5713 Datasheet HTML 63Page - Texas Instruments TAS5713 Datasheet HTML 64Page - Texas Instruments TAS5713 Datasheet HTML 65Page - Texas Instruments TAS5713 Datasheet HTML 66Page - Texas Instruments TAS5713 Datasheet HTML 67Page - Texas Instruments TAS5713 Datasheet HTML 68Page - Texas Instruments TAS5713 Datasheet HTML 69Page - Texas Instruments TAS5713 Datasheet HTML 70Page - Texas Instruments TAS5713 Datasheet HTML 71Page - Texas Instruments Next Button
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EXAMPLE BOARD LAYOUT
0.05 MAX
ALL AROUND
0.05 MIN
ALL AROUND
(8.5)
(8.5)
44X (0.5)
48X (1.6)
48X (0.3)
(
0.2) TYP
VIA
(4.03)
(
6.5)
NOTE 10
(R0.05) TYP
(1.1 TYP)
(1.1 TYP)
(5.17)
PowerPAD
HTQFP - 1.2 mm max height
PHP0048K
PLASTIC QUAD FLATPACK
4224002/A 12/2017
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
8. This package is designed to be soldered to a thermal pad on the board. See technical brief, Powerpad thermally enhanced package,
Texas Instruments Literature No. SLMA002 (www.ti.com/lit/slma002) and SLMA004 (www.ti.com/lit/slma004).
9. Vias are optional depending on application, refer to device data sheet. It is recommended that vias under paste be filled, plugged
or tented.
10. Size of metal pad may vary due to creepage requirement.
TM
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:8X
SYMM
SYMM
48
37
13
24
25
36
1
12
SOLDER MASK
DEFINED PAD
METAL COVERED
BY SOLDER MASK
49
SEE DETAILS
METAL
SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
SOLDER MASK DETAILS
EXPOSED METAL
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
SOLDER MASK
DEFINED
EXPOSED METAL



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