5.4 Thermal Information

THERMAL METRIC (2) (1)

Legacy Chip

Only

Legacy Chip

New Chip

UNIT

NGD (WSON)

(3)

DBV

(SOT23-5)

DBV

(SOT23-5)

6 PINS

5 PINS

5 PINS

RθJA

Junction-to-ambient thermal resistance

72.3

169.7

178.6

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

81.6

122.6

77.9

°C/W

RθJB

Junction-to-board thermal resistance

39.5

29.9

47.2

°C/W

ψJT

Junction-to-top characterization parameter

2

16.7

15.9

°C/W

ψJB

Junction-to-board characterization parameter

39.2

29.4

46.9

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

11.6

−

−

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

note.

(2)

Thermal performance results are based on the JEDEC standard of 2s2p PCB configuration. These thermal metric parameters can be

further improved by 35-55% based on thermally optimized PCB layout designs. See the analysis of the Impact of board layout on LDO

thermal performance application report.

(3)

The PCB for the NGD (WSON) package RθJA includes two (2) thermal vias under the exposed thermal pad per EIA/JEDEC

JESD51-5.

5.5 Electrical Characteristics

specified at TJ = 25°C, VIN = VOUT(nom) + 1.0 V or VIN = 2.5 V (whichever is greater), IOUT = 1 mA, VON/OFF = 2 V, CIN = 1.0

µF, and COUT = 2.2 µF (unless otherwise noted)

PARAMETER

TEST CONDITIONS

MIN

TYP MAX UNIT

∆VOUT

Output voltage tolerance

IL = 1 mA

Legacy chip

(standard

grade)

–1.5

1.5

%

Legacy chip

(A grade)

–1.0

1.0

New chip

–0.5

0.5

1 mA ≤ IL ≤ 50 mA

Legacy chip

(standard

grade)

–2.5

2.5

Legacy chip

(A grade)

–1.5

1.5

New chip

–0.5

0.5

1 mA ≤ IL ≤ 50 mA, –40°C ≤ TJ ≤ 125°C

Legacy chip

(standard

grade)

–3.5

3.5

Legacy chip

(A grade)

–2.5

2.5

New chip

–1

1

1 mA ≤ IL ≤ 250 mA

Legacy chip

(standard

grade)

–4

4

Legacy chip

(A grade)

–3.5

3.5

New chip

–0.5

0.5

1 mA ≤ IL ≤ 250 mA, –40°C ≤ TJ ≤ 125°C

Legacy chip

(standard

grade)

–5

5

Legacy chip

(A grade)

–4.5

4.5

New chip

–1

1

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LP2992

SNVS171L – NOVEMBER 2001 – REVISED FEBRUARY 2025

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