LM5102

SNVS268B – MAY 2004 – REVISED DECEMBER 2014

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6 Specifications

6.1 Absolute Maximum Ratings

(1) (2)

MIN

MAX

UNIT

VDD to VSS

–0.3

18

V

VHB to VHS

–0.3

18

V

LI or HI Inputs to VSS

–0.3

VDD + 0.3

V

LO Output

–0.3

VDD + 0.3

V

HO Output

VHS – 0.3

VHB + 0.3

V

VHS to VSS

–1

100

V

VHB to VSS

118

V

RT1 and RT2 to VSS

–0.3

5

V

Junction Temperature

150

°C

Storage Temperature Range

–55

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and

specifications.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

V

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

MIN

MAX

UNIT

VDD

9

14

V

HS

–1

100

V

HB

VHS + 8

VHS + 14

V

HS Slew Rate

< 50

V/ns

Junction Temperature

–40

125

°C

6.4 Thermal Information

LM5102

THERMAL METRIC(1)

DGS

DPR(2)

UNIT

10 PINS

10 PINS

RθJA

Junction-to-ambient thermal resistance

165.3

37.9

RθJC(top)

Junction-to-case (top) thermal resistance

58.9

38.1

RθJB

Junction-to-board thermal resistance

54.4

14.9

°C/W

ψJT

Junction-to-top characterization parameter

6.2

0.4

ψJB

Junction-to-board characterization parameter

83.6

15.2

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

4.4

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report (SPRA953).

(2)

4 layer board with Cu finished thickness 1.5 oz, 1 oz, 1 oz, 1.5 oz. Maximum die size used. 5x body length of Cu trace on PCB top. 50 x

50 mm ground and power planes embedded in PCB. See Application Note AN-1187 Leadless Leadframe Package (LLP) (SNOA401).

4

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