VDD

HB

HO

HS

LO

VSS

LI

HI

1

10

2

9

3

8

4

7

RT1

RT2

5

6

LM5102

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SNVS268B – MAY 2004 – REVISED DECEMBER 2014

5 Pin Configuration and Functions

10 Pin

VSSOP (DGS), WSON (DPR)

Top View

Pin Functions

PIN

TYPE(1)

DESCRIPTION

APPLICATION INFORMATION

WSON(2),

NAME

VSSOP

Connect the positive terminal of bootstrap

capacitor to the HB pin and connect negative

HB

2

P

High-side gate driver bootstrap rail

terminal of bootstrap capacitor to HS. The

Bootstrap capacitor should be placed as close to

IC as possible.

TTL compatible thresholds. Unused inputs should

HI

7

I

High-side driver control input

be tied to ground and not left open.

Connect to gate of high-side MOSFET with short

HO

3

O

High-side gate driver output

low-inductance path.

Connect bootstrap capacitor negative terminal and

HS

4

P

High-side MOSFET source connection

source of high side MOSFET.

TTL compatible thresholds. Unused inputs should

LI

8

I

Low-side driver control input

be tied to ground and not left open.

Connect to the gate of the low side MOSFET with

LO

10

O

Low-side gate driver output

a short low inductance path.

Resistor from RT1 to ground programs the leading

High-side output edge delay

edge delay of the high side gate driver. The

RT1

5

A

programming

resistor should be placed close to the IC to

minimize noise coupling from adjacent traces.

Resistor from RT2 to ground programs the leading

Low-side output edge delay

edge delay of the low side gate driver. The

RT2

6

A

programming

resistor should be placed close to the IC to

minimize noise coupling from adjacent traces.

Locally decouple to VSS using low ESR/ESL

VDD

1

P

Positive gate drive supply

capacitor, located as close to IC as possible.

VSS

9

G

Ground return

All signals are referenced to this ground.

(1)

P = Power, G = Ground, I = Input, O = Output, A = Analog

(2)

For the WSON package, it is recommended that the exposed pad on the bottom of the LM5100 and LM5101 be soldered to ground

plane on the PC board, and the ground plane should extend out from beneath the IC to help dissipate the heat.

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