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L9679E датащи(PDF) 69 Page - STMicroelectronics |
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L9679E датащи(HTML) 69 Page - STMicroelectronics |
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69 / 127 page ![]() Figure 12. Analog deployment block diagram SSxy SFx SRx SGxy 22nF 22nF Rsquib/ pyroswitch - + LS_ON + - HS_ON To deploy current >90% counter 5%R 95%R R/2000 (50mΩ) OP with switching Offset compensation IREF= 1mA 2000 x IREF Open to short comp R Vclamp >35V Same power transistor VINT3V3 Enable _HSx EN_ISINK OPphase OPphase LS_OC_Comp GNDSUB1&2 Loss ground diode + - LS_Loss _Gnd Ipulldown Ilimit = 70mA typ Enable _LSx Passive Switch -off Active Switch -off Passive Switch -off Active Switch -off SSxy VINT3V3 VINT3V3 GADG0603181553PS 7.1.1 Safe operating area vs deployment current profiles Deployment current is programmed for each channel using the Deploy Configuration Register (DCRx) shown in DCR_x(x=0, 2, 4, 6) and DCR_x(x=1, 3, 5, 7). In the same register the Deploy Time Selection allows the device to deploy for a time up to 4.032 ms. In order to prevent device damage, a constraint on squib/pyroswitch supply voltage versus maximum Tj at the deployment start shall be specified as following: Squib/Pyroswitch Deploy current profile = 1.2 A / 2 ms (DCR_Deploy_Time ≤ 34): 6 V ≤ V_SSxy ≤ 22.75 V with -40 °C ≤ Tj_start ≤ 130 °C; 6 V ≤ V_SSxy ≤ 21.5 V with -40 °C ≤ Tj_start ≤ 150 °C; Squib/Pyroswitch Deploy current profile = 1.75 A / 700 µs (DCR_Deploy_Time ≤ 13): 9 V ≤ V_SSxy ≤ 25 V with -40 °C ≤ Tj_start ≤ 115 °C; 9 V ≤ V_SSxy ≤ 23.75 V with -40 °C ≤ Tj_start ≤ 130 °C; 9 V ≤ V_SSxy ≤ 22.5 V with -40 °C ≤ Tj_start ≤ 150 °C; Squib/Pyroswitch Deploy current profile = 1.75 A / 500 µs (DCR_Deploy_Time ≤ 10): 9 V ≤ V_SSxy ≤ 25 V with -40 °C ≤ Tj_start ≤ 150 °C; Squib/Pyroswitch Deploy current profile = 1.2 A / 3.2 ms (DCR_Deploy_Time ≤ 54): 6 V ≤ V_SSxy ≤ 20.1 V with -40 °C ≤ Tj_start ≤ 130 °C; 6 V ≤ V_SSxy ≤ 19.3 V with -40 °C ≤ Tj_start ≤ 150 °C; Squib/Pyroswitch Deploy current profile = 1.75 A / 2 ms (DCR_Deploy_Time ≤ 34): L9679E Deployment drivers DS12485 - Rev 8 page 69/127 |
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