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AMC7836IPAPR датащи(PDF) 89 Page - Texas Instruments

номер детали AMC7836IPAPR
подробное описание детали  AMC7836 High-Density, 12-Bit Analog Monitor and Control Solution With Multichannel ADC, Bipolar DACs, Temperature Sensor, and GPIO Ports
PDF  91 Pages
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производитель  TI2 [Texas Instruments]
домашняя страница  https://www.ti.com
Logo TI2 - Texas Instruments

AMC7836IPAPR датащи(HTML) 89 Page - Texas Instruments

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EXAMPLE BOARD LAYOUT
0.05 MAX
ALL AROUND
0.05 MIN
ALL AROUND
(11.4)
(11.4)
60X (0.5)
64X (1.5)
64X (0.3)
(
0.2) TYP
VIA
(
7)
(
8)
NOTE 8
(R0.05)
TYP
(1.3 TYP)
(1.3 TYP)
PowerPAD
TQFP - 1.2 mm max height
PAP0064G
PLASTIC QUAD FLATPACK
4218924/A 01/2022
TM
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
8. This package is designed to be soldered to a thermal pad on the board. See technical brief, Powerpad thermally enhanced package,
Texas Instruments Literature No. SLMA002 (www.ti.com/lit/slma002) and SLMA004 (www.ti.com/lit/slma004).
9. Vias are optional depending on application, refer to device data sheet. It is recommended that vias under paste be filled,
plugged or tented.
10. Size of metal pad may vary due to creepage requirement.
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:6X
SYMM
64
49
17
32
33
48
1
16
SOLDER MASK
DEFINED PAD
METAL COVERED
BY SOLDER MASK
65
SEE DETAILS
SYMM
METAL
SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
SOLDER MASK DETAILS
EXPOSED METAL
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
SOLDER MASK
DEFINED
EXPOSED METAL



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