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SY75608 датащи(PDF) 34 Page - Microchip Technology

номер детали SY75608
подробное описание детали  8 or 12 Output Ultra-Low Additive Jitter
PDF  44 Pages
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производитель  MICROCHIP [Microchip Technology]
домашняя страница  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

SY75608 датащи(HTML) 34 Page - Microchip Technology

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SY75608/612
DS20006363D-page 34
2021 - 2023 Microchip Technology Inc. and its subsidiaries
RECOMMENDED LAND PATTERN
Dimension Limits
Units
C2
Optional Center Pad Width
Contact Pad Spacing
Optional Center Pad Length
Contact Pitch
Y2
X2
4.20
4.20
MILLIMETERS
0.40 BSC
MIN
E
MAX
5.90
Contact Pad Length (X48)
Contact Pad Width (X48)
Y1
X1
0.85
0.20
NOM
C1
0
9
.
5
g
n
i
c
a
p
S
d
a
P
t
c
a
t
n
o
C
Contact Pad to Center Pad (X48)
G1
0.20
Thermal Via Diameter
V
Thermal Via Pitch
EV
0.30
1.00
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Notes:
Dimensioning and tolerancing per ASME Y14.5M
For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during
reflow process
1.
2.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
Contact Pad to Contact Pad (X44)
G2
0.20
C1
C2
EV
EV
X2
Y2
Y1
X1
G1
G2
ØV
1
2
48
E
SILK SCREEN
Microchip Technology Drawing C04-2494 Rev A
48-Lead Very Thin Plastic Quad Flat, No Lead (6LX) - 6x6 mm Body [VQFN]
With 4.1x4.1 mm Exposed Pad



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