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TMP390 датащи(PDF) 11 Page - Texas Instruments |
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TMP390 датащи(HTML) 11 Page - Texas Instruments |
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11 / 27 page ![]() RSETA RSETB VDD VDD or VDDIO TMP39x RP RP SETA SETB OUTA OUTB Optional Trip Test RSETA and RSETB select trip thresholds and hysteresis options. 11 TMP392 www.ti.com SNIS216 – NOVEMBER 2019 Product Folder Links: TMP392 Submit Documentation Feedback Copyright © 2019, Texas Instruments Incorporated 8 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 8.1 Applications Information The TMP392 device is part of a family of ultra-low power, dual channel, resistor programmable temperature switches that can enable detection and protection of system thermal events over a wide temperature range. The trip temperatures (TTRIP) and hysteresis options are programmed by two E96-series (1%) standard decade value resistors on the SETA and SETB pins. The thermal hysteresis (THYST) function is to prevent undesired digital output switching due to small temperature changes. 8.2 Typical Applications 8.2.1 Simplified Application Schematic Figure 9 shows the simplified schematic where RSETA and RSETB are used to set channel A trip point (SETA) and channel B trip point and hysteresis for both channels (SETB). SETA and SETB can be programmed at a variety of temperatures based on the device, as described in Table 1 for channel A trip point, and Table 2 for channel B trip point and hysteresis for both channels. OUTA and OUTB outputs correspond to the temperature threshold detection at SETA and SETB, respectively. Figure 9. Simplified Schematic 8.2.1.1 Design Requirements The TMP392 requires two resistors to set the high and low trip points and hysteresis, and two pullup resistors for the open-drain device. TI also highly recommends to place a 0.1-µF, power-supply bypassing capacitor close to the VDD supply pin. To minimize the internal power dissipation, use two pullup resistors greater than 1 kΩ from the OUTA and OUTB pins to the VDD pin. A separate supply, VDDIO, may be used for the pullup voltage to set the output voltage level to the level required by the MCU, as shown in Figure 9. The open-drain output gives flexibility of pulling up to any voltage independent of VDD (VDDIO must be less than or equal to VDD + 0.3 V). This allows for use of longer cables or different power supply options. If a separate voltage level is not required, TI recommends to tie the pullup to the TMP392 VDD. If the SETA or SETB connected resistor value is outside the legal range, the associated output goes to permanent output zero stage and the channel cannot be used. The other channel still will be in operating condition, and device can be used in one channel mode. If the SETB input is grounded or left floating, the Channel B cannot be used and the hysteresis for Channel A will be 20°C. The SETA and SETB connected resistors are measured during POR. If two consecutive measurements are not matching each other, then the device sets the associated channel output to zero and repeats the resistor measurements until the measurements match. When the measurements match, the channel output is released. Note that it is possible to connect some device outputs together by shorting the OUTA or OUTB line. |
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