9

TMP392

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SNIS216 – NOVEMBER 2019

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Feature Description (continued)

Table 1. TMP392 Channel A Threshold Setting (continued)

CHANNEL A (HOT)

TRIP TEMPERATURE

(°C)

CHANNEL A NOMINAL 1%

RESISTORS (KΩ)

CHANNEL A (HOT) TRIP RESET

TEMPERATURE (°C) FOR

HYSTERESIS = 5°C

CHANNEL A (HOT) TRIP RESET

TEMPERATURE (°C) FOR

HYSTERESIS = 10°C

122

787

117

112

124

909

119

114

NOTE

When the SETA pin is grounded or left floating during the device power up, the OUTA pin

always stays low. The Channel B functionality is not affected by the SETA channel.

Table 2. TMP392 Channel B Threshold and Hysteresis Setting

CHANNEL B

(WARM) TRIP

TEMPERATURE (°C)

CHANNEL B NOMINAL 1% RESISTORS (KΩ)

CHANNEL B (WARM) TRIP RESET TEMPERATURE (°C)

HYSTERESIS = 5°C

HYSTERESIS = 10°C

HYSTERESIS = 5°C

HYSTERESIS = 10°C

30

90.9

105

25

20

35

78.7

121

30

25

40

68.1

140

35

30

45

59.0

162

40

35

50

51.1

187

45

40

55

44.2

215

50

45

60

38.3

249

55

50

65

33.2

287

60

55

70

28.7

332

65

60

75

24.9

383

70

65

80

21.5

442

75

70

85

18.7

511

80

75

90

16.2

590

85

80

95

14.0

681

90

85

100

12.1

787

95

90

105

10.5

909

100

95

NOTE

When the SETB pin is grounded or left floating during the POR, the OUTB pin always

stays low and the Channel A hysteresis is set to 20°C.

7.3.2 Trip Test

The purpose of the trip test is in system manufacturing test without putting the TMP392 through costly

temperature verification of the assembly of TMP392 and pullup resistors. When the SETA or SETB pin is set to a

high logic level, the associated output goes low. When the input pin level goes low, the output goes to its

previous condition before the trip test. The trip test does not affect the current condition of the device. The trip

test signals should stay above 0.8 × VDD for logic high and below 0.2 × VDD for logic low.

The trip test operation is shown in Figure 8. The trip test must be performed with a single toggle when the device

is operating at a temperature that will not cause the corresponding output to trip. The trip test is intended for

production testing after assembly, and must not be used as a functional feature.