4

TMP116, TMP116N

SBOS740A – MAY 2017 – REVISED MAY 2019

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6 Specifications

6.1 Absolute Maximum Ratings

MIN

MAX

UNIT

Supply voltage, V+

–0.3

6

V

Voltage at SCL, SDA, ALERT, and ADD0

–0.3

6

V

Operating junction temperature, TJ

–55

150

°C

Storage temperature, Tstg

–65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

V

Charged-device model (CDM), per JEDEC specification JESD22-C101(2)

±1000

6.3 Recommended Operating Conditions

MIN

NOM

MAX

UNIT

V+

Supply voltage

1.9

3.3

5.5

V

TA

Operating free-air temperature

–55

150

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.4 Thermal Information

THERMAL METRIC(1)

TMP116

UNIT

DRV (WSON)

6 PINS

RθJA

Junction-to-ambient thermal resistance

68.7

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

70.3

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

9.5

°C/W

RθJB

Junction-to-board thermal resistance

38.3

°C/W

ψJT

Junction-to-top characterization parameter

1.7

°C/W

ψJB

Junction-to-board characterization parameter

38.6

°C/W

MT

Thermal Mass

5.1

mJ/°C